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5CSEMA4U23C7N - Intel

Description: FPGA Cyclone® V SE Family 40000 Cells 28nm Technology 1.1V 672-Pin UBGA Tray

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5CSEMA4U23C7N - Intel - PCB symbol
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PCB Footprints
5CSEMA4U23C7N - Intel PCB footprint - BGA - BGA - 672-Pin Ultra FineLine Ball-Grid Array (UBGA)_1
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3D Models
5CSEMA4U23C7N - Intel - 3D model - BGA - 672-Pin Ultra FineLine Ball-Grid Array (UBGA)_1
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5CSEMA4U23C7N Details

  • Manufacturer Part Number:

    5CSEMA4U23C7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, UBGA-672

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B672

  • Length:

    23 mm

  • Number of Inputs:

    326

  • Number of Outputs:

    326

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    85 °C

  • Organization:

    1588 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA672,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.85 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

5CSEMA4U23C7N Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 5CSEMA4U23C7N is -40°C to 100°C.
  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the TLV7031, which provides a reset signal to the FPGA during power-up and power-down sequences.
  • Intel recommends following the PCB layout and routing guidelines outlined in the 5CSEMA4U23C7N datasheet, including using a 4-layer PCB, separating analog and digital signals, and minimizing signal trace lengths.
  • To optimize power consumption, use the Intel Quartus Prime software to enable power-saving features, such as clock gating, and implement power-aware design techniques, like dynamic voltage and frequency scaling.
  • Intel recommends using 0.1 μF and 10 μF decoupling capacitors, placed as close as possible to the FPGA's power pins, to ensure reliable power supply decoupling.

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5CSEMA4U23C7N Overview

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