Please enter a minimum 3 letters or numbers
Technical Content
Part Image

5CSEMA4U23I7N - Intel

Description: FPGA - Field Programmable Gate Array CycloneV SoC SE dual -core ARM Cortex-A9

Download 5CSEMA4U23I7N Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
5CSEMA4U23I7N - Intel - PCB symbol
click to zoom
PCB Footprints
5CSEMA4U23I7N - Intel PCB footprint - BGA - BGA - 672-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.85
click to zoom
3D Models
5CSEMA4U23I7N - Intel - 3D model - BGA - 672-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond - A:1.85
click to zoom

5CSEMA4U23I7N Details

  • Manufacturer Part Number:

    5CSEMA4U23I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, UBGA-672

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B672

  • Length:

    23 mm

  • Number of Inputs:

    326

  • Number of Outputs:

    326

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1588 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA672,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.85 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

5CSEMA4U23I7N Frequently Asked Questions (FAQs)

  • Intel provides a reference design guide with layout recommendations, including decoupling capacitor placement and signal routing guidelines.
  • Use the Intel PowerPlay Early Power Estimator (EPE) tool to estimate power consumption and optimize your design by reducing clock frequencies, using low-power modes, and minimizing switching activity.
  • Ensure good airflow, use a heat sink or thermal interface material, and consider thermal simulation tools like Intel's Thermal Design Tool to manage junction temperatures.
  • Use Intel's FPGA-based security features, such as the Secure Boot mechanism, and implement encryption and secure key storage to protect your IP.
  • Intel provides the Quartus II software, which includes a development environment, IP cores, and a software development kit (SDK) for creating and programming the FPGA.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

5CSEMA4U23I7N Overview

Use the download button to access the 5CSEMA4U23I7N schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 5CSEM, or try a keyword search, such as Field Programmable Gate Arrays

Parts related to 5CSEMA4U23I7N

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑