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5CSEMA5F31C6N - Intel

Description: FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9

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5CSEMA5F31C6N - Intel PCB footprint - BGA - BGA - 896-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CSEMA5F31C6N - Intel  - 3D model - BGA - 896-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00
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5CSEMA5F31C6N Details

  • Manufacturer Part Number:

    5CSEMA5F31C6N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, FBGA-896

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B896

  • JESD-609 Code:

    e1

  • Length:

    31 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    469

  • Number of Outputs:

    469

  • Number of Terminals:

    896

  • Operating Temperature-Max:

    85 °C

  • Organization:

    3207 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA896,30X30,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    31 mm

5CSEMA5F31C6N Frequently Asked Questions (FAQs)

  • Intel provides a reference design guide for the 5CSEMA5F31C6N, which includes recommendations for PCB layout, thermal design, and power delivery. It's essential to follow these guidelines to ensure optimal performance, power efficiency, and thermal management.
  • Intel provides a Clock Tree Optimization Guide for the 5CSEMA5F31C6N, which includes guidelines for clock tree architecture, clock domain crossing, and clock skew management. Additionally, Intel's Quartus Prime software provides tools and features to help optimize the clock tree.
  • Intel recommends using a power management IC (PMIC) specifically designed for the 5CSEMA5F31C6N, such as the Intel Enpirion Power Solutions. It's essential to follow Intel's power management guidelines and to carefully design the power delivery network to ensure reliable operation and minimize power consumption.
  • Intel provides guidelines for signal integrity and EMI mitigation in the 5CSEMA5F31C6N datasheet and application notes. It's essential to follow best practices for PCB layout, signal routing, and shielding to minimize EMI and ensure signal integrity.
  • Intel recommends using the Quartus Prime software and the Intel FPGA IP Catalog to develop and verify IP cores for the 5CSEMA5F31C6N. Additionally, Intel provides a range of development tools, such as the Intel SoC FPGA Embedded Development Suite, to support IP core development and verification.

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5CSEMA5F31C6N Overview

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