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5CSEMA6F31I7N - Intel

Description: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Cyclone® V SE FPGA - 110K Logic Elements 64KB 800MHz 896-FBGA (31x31)

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5CSEMA6F31I7N - Intel PCB footprint - BGA - BGA - 896-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.4
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5CSEMA6F31I7N - Intel  - 3D model - BGA - 896-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.4
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5CSEMA6F31I7N Details

  • Manufacturer Part Number:

    5CSEMA6F31I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, FBGA-896

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B896

  • JESD-609 Code:

    e1

  • Length:

    31 mm

  • Moisture Sensitivity Level:

    3

  • Number of Inputs:

    469

  • Number of Outputs:

    469

  • Number of Terminals:

    896

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4191 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA896,30X30,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    31 mm

5CSEMA6F31I7N Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the 5CSEMA6F31I7N is -40°C to 100°C.
  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the TLV7031, which can detect the power supply voltage and generate a reset signal when the voltage is below a certain threshold.
  • A good PCB layout and routing strategy for the 5CSEMA6F31I7N involves using a multi-layer PCB, separating analog and digital signals, and following Intel's guidelines for signal integrity and power distribution.
  • Optimizing timing closure for the 5CSEMA6F31I7N involves using Intel's Quartus II software to analyze and optimize the design, as well as using techniques such as pipelining, retiming, and clock domain crossing.
  • The recommended decoupling capacitor values and placement for the 5CSEMA6F31I7N involve using a combination of high-frequency and low-frequency capacitors, with values ranging from 10nF to 10uF, placed close to the FPGA's power pins.

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5CSEMA6F31I7N Overview

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