70P249L65BYGI - Renesas Electronics

70P249L65BYGI Details

• Manufacturer Part Number:

  70P249L65BYGI

• Brand Name:

  Renesas

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  CABGA

• Pin Count:

  100

• Manufacturer Package Code:

  BYG100

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.41

• Manufacturer:

  Renesas Electronics Corporation

• YTEOL:

  0

• Access Time-Max:

  40 ns

• I/O Type:

  COMMON

• JESD-30 Code:

  S-PBGA-B100

• JESD-609 Code:

  e1

• Length:

  6 mm

• Memory Density:

  65536 bit

• Memory IC Type:

  MULTI-PORT SRAM

• Memory Width:

  16

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Ports:

  2

• Number of Terminals:

  100

• Number of Words:

  4096 words

• Number of Words Code:

  4000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  4KX16

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  VFBGA

• Package Equivalence Code:

  BGA100,10X10,20

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

• Parallel/Serial:

  PARALLEL

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1 mm

• Standby Current-Max:

  0.000006 A

• Supply Current-Max:

  0.07 mA

• Supply Voltage-Max (Vsup):

  3 V

• Supply Voltage-Min (Vsup):

  1.8 V

• Supply Voltage-Nom (Vsup):

  2.6 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  TIN SILVER COPPER

• Terminal Form:

  BALL

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  6 mm