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70T3339S133BFI - Renesas Electronics

Description: The 70T3339 is a high-speed 512K x 18 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. The 70T3339 can support an operating voltage of either 3.3V or 2.5V on one or both ports, controllable by the OPT pins. The power supply for the core of the device (VDD) is at 2.5V.

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70T3339S133BFI - Renesas Electronics - PCB symbol
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70T3339S133BFI - Renesas Electronics PCB footprint - BGA - BGA - BFG208
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70T3339S133BFI - Renesas Electronics - 3D model - BGA - BFG208
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70T3339S133BFI Details

  • Manufacturer Part Number:

    70T3339S133BFI

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CABGA

  • Pin Count:

    208

  • Manufacturer Package Code:

    BF208

  • ECCN Code:

    3A991.B.2.A

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    15 ns

  • Additional Feature:

    FLOW-THROUGH OR PIPELINED ARCHITECTURE

  • Clock Frequency-Max (fCLK):

    133 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PBGA-B208

  • JESD-609 Code:

    e0

  • Length:

    15 mm

  • Memory Density:

    9437184 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    18

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    208

  • Number of Words:

    524288 words

  • Number of Words Code:

    512000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512KX18

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA208,17X17,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    225

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Standby Current-Max:

    0.02 A

  • Standby Voltage-Min:

    2.4 V

  • Supply Current-Max:

    0.45 mA

  • Supply Voltage-Max (Vsup):

    2.6 V

  • Supply Voltage-Min (Vsup):

    2.4 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    15 mm

70T3339S133BFI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide for the 70T3339S133BFI, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal thermal performance. Contact Renesas support for the layout guide.
  • The 70T3339S133BFI has an internal overcurrent protection feature, but it's recommended to implement an external overcurrent protection circuit to ensure reliable operation. Renesas provides application notes and design guides for implementing overcurrent protection.
  • The recommended power-up sequence for the 70T3339S133BFI is to apply the power supply voltage (VCC) before the input voltage (VIN). This ensures proper device initialization and prevents potential damage.
  • Renesas provides an I2C interface troubleshooting guide that covers common issues, such as bus contention, clock stretching, and data corruption. The guide includes steps for debugging and resolving I2C interface issues.
  • While the datasheet specifies an operating temperature range of -40°C to 125°C, the guaranteed specifications are only valid up to 105°C. For operation above 105°C, consult with Renesas support for derating guidelines.

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70T3339S133BFI Overview

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70T3339S133BFI Alternates

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Part Image IDT70T3339S133BFG Integrated Device Technology Inc

Multi-Port SRAM, 512KX18, 4.2ns, CMOS, CBGA208
Part Image IDT70T3339S133BFI8 Integrated Device Technology Inc

Multi-Port SRAM, 512KX18, 15ns, CMOS, PBGA208
Part Image IDT70T3339S133BFGI8 Integrated Device Technology Inc

Multi-Port SRAM, 512KX18, 15ns, CMOS, PBGA208
Part Image IDT70T3339S133BFG Renesas Electronics Corporation

Multi-Port SRAM, 512KX18, 4.2ns, CMOS, CBGA208
Part Image IDT70T3339S133BF Renesas Electronics Corporation

Multi-Port SRAM, 512KX18, 15ns, CMOS, PBGA208
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