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70T3799MS133BBGI - Renesas Electronics

Description: The 70T3799M is a high-speed 128K x 72 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. The 70T3799M can support an operating voltage of either 3.3V or 2.5V on one or both ports, controllable by the OPT pins. The power supply for the core of the device (VDD) is at 2.5V.

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70T3799MS133BBGI - Renesas Electronics PCB footprint - BGA - BGA - 324-CABGA (19x19)
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70T3799MS133BBGI - Renesas Electronics - 3D model - BGA - 324-CABGA (19x19)
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70T3799MS133BBGI Details

  • Manufacturer Part Number:

    70T3799MS133BBGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    PBGA

  • Pin Count:

    324

  • Manufacturer Package Code:

    BBG324

  • ECCN Code:

    3A991.B.2.A

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    15 ns

  • Additional Feature:

    PIPELINED OR FLOW-THROUGH ARCHITECTURE

  • Clock Frequency-Max (fCLK):

    133 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Memory Density:

    9437184 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    72

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    324

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128KX72

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA324,18X18,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Standby Current-Max:

    0.025 A

  • Standby Voltage-Min:

    2.4 V

  • Supply Current-Max:

    0.9 mA

  • Supply Voltage-Max (Vsup):

    2.6 V

  • Supply Voltage-Min (Vsup):

    2.4 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

70T3799MS133BBGI Frequently Asked Questions (FAQs)

  • Renesas provides a reference design guide and thermal design guidelines in their application notes and design resources. It's essential to follow these guidelines to ensure proper heat dissipation and signal integrity.
  • Renesas recommends using a low-dropout regulator (LDO) with a high power supply rejection ratio (PSRR) to minimize noise and voltage fluctuations. Additionally, follow the datasheet's guidelines for decoupling capacitors and noise reduction techniques.
  • The 70T3799MS133BBGI requires a high-quality clock signal with minimal jitter and noise. Use a clock generator with a low jitter specification, and ensure the clock signal is properly terminated and routed on the PCB to minimize signal degradation.
  • Renesas provides software development kits (SDKs) and example code for the 70T3799MS133BBGI. Follow the SDK guidelines and optimize the firmware and software for performance, power consumption, and security by using techniques such as clock gating, power gating, and secure boot mechanisms.
  • Renesas provides reliability data and quality metrics in their datasheet and quality documentation. Ensure long-term reliability by following proper design and manufacturing guidelines, using qualified components, and performing thorough testing and validation.

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