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70T633S12BFI - Renesas Electronics

Description: The 70T633 is a high-speed 512K x 18 Asynchronous Dual-Port Static RAM designed to be used as a stand-alone Dual-Port RAM or as a combination MASTER/ SLAVE Dual-Port RAM for 36-bit-or-more word system which would result in full-speed, error-free operation without the need for additional discrete logic. An automatic power down feature controlled by the chip enables (either CE0 or CE1) permit the on-chip circuitry of each port to enter a very low standby power mode.

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70T633S12BFI - Renesas Electronics - PCB symbol
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70T633S12BFI - Renesas Electronics PCB footprint - BGA - BGA - BF208
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70T633S12BFI - Renesas Electronics - 3D model - BGA - BF208
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70T633S12BFI Details

  • Manufacturer Part Number:

    70T633S12BFI

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CABGA

  • Pin Count:

    208

  • Manufacturer Package Code:

    BF208

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4

  • Access Time-Max:

    12 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PBGA-B208

  • JESD-609 Code:

    e0

  • Length:

    15 mm

  • Memory Density:

    9437184 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    18

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    208

  • Number of Words:

    524288 words

  • Number of Words Code:

    512000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512KX18

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA208,17X17,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    225

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Standby Current-Max:

    0.02 A

  • Standby Voltage-Min:

    2.4 V

  • Supply Current-Max:

    0.395 mA

  • Supply Voltage-Max (Vsup):

    2.6 V

  • Supply Voltage-Min (Vsup):

    2.4 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    15 mm

70T633S12BFI Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ranges, and that the PCB is designed to minimize thermal gradients. Additionally, consider using thermal simulation tools to optimize the design.
  • Critical timing parameters include clock frequency, setup and hold times, and output delay. Ensure timing closure by using a timing analyzer tool, such as IBIS-AMI or a proprietary tool from Renesas, to verify signal integrity and timing margins.
  • Follow the recommended power sequencing guidelines in the datasheet, and ensure that the power supply rails are stable before enabling the device. Implement a POR circuit to ensure a clean reset during power-up.
  • Implement ESD protection using TVS diodes or ESD arrays, and follow latch-up prevention guidelines in the datasheet. Ensure that the PCB design minimizes parasitic capacitance and inductance.

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70T633S12BFI Overview

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70T633S12BFI Alternates

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Image Part Number Model
Part Image IDT70T633S12BFGI Integrated Device Technology Inc

Multi-Port SRAM, 512KX18, 12ns, CMOS, PBGA208
Part Image 70T633S12BFGI Integrated Device Technology Inc

Multi-Port SRAM, 512KX18, 12ns, CMOS, PBGA208
Part Image 70T633S12BFGI8 Integrated Device Technology Inc

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Part Image 70T633S12BFI Integrated Device Technology Inc

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Part Image IDT70T633S12BFI Renesas Electronics Corporation

Multi-Port SRAM, 512KX18, 12ns, CMOS, PBGA208
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