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70V3599S133BFGI8 - Renesas Electronics

Description: The 70V3599 is a high-speed 128K x 36 bit synchronous Dual-Port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power down feature, controlled by CE0 and CE1, permits the on-chip circuitry of each port to enter a very low standby power mode. The 70V3599 can support an operating voltage of either 3.3V or 2.5V on one or both ports, controllable by the OPT pins. The power supply for the core of the device (VDD) is at 3.3V.

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70V3599S133BFGI8 - Renesas Electronics PCB footprint - BGA - BGA - BF208
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70V3599S133BFGI8 Details

  • Manufacturer Part Number:

    70V3599S133BFGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CABGA

  • Pin Count:

    208

  • Manufacturer Package Code:

    BFG208

  • ECCN Code:

    3A991.B.2.A

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    15 ns

  • Additional Feature:

    FLOW-THROUGH OR PIPELINED ARCHITECTURE

  • Clock Frequency-Max (fCLK):

    133 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PBGA-B208

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Memory Density:

    4718592 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    208

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128KX36

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA208,17X17,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.7 mm

  • Standby Current-Max:

    0.04 A

  • Standby Voltage-Min:

    3.15 V

  • Supply Current-Max:

    0.48 mA

  • Supply Voltage-Max (Vsup):

    3.45 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15 mm

70V3599S133BFGI8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APL-AN-1201) which includes thermal management guidelines, such as using thermal vias, thermal pads, and heat sinks to ensure optimal heat dissipation.
  • Renesas recommends a specific power sequencing scheme to ensure proper device operation. This involves powering up the VCCIO and VCC cores in a specific order, followed by the VREF and VTT supplies. Refer to the datasheet and application notes for detailed guidelines.
  • Renesas recommends using termination resistors with a value of 50-60 ohms for the high-speed interfaces, such as DDR3 and PCIe, to ensure signal integrity and minimize reflections. The exact value may vary depending on the specific application and PCB layout.
  • Renesas provides a JTAG interface for debugging and testing purposes. To use it, connect a JTAG debugger or emulator to the device's JTAG pins, and use the Renesas-provided software tools, such as the Renesas Flash Programmer, to access and control the device.
  • The 70V3599S133BFGI8 is available in a 133-BGA package, which requires careful thermal design consideration. Ensure good thermal contact between the device and the heat sink, and use thermal interface materials (TIMs) to minimize thermal resistance. Renesas provides thermal design guidelines in their application notes.

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70V3599S133BFGI8 Overview

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