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70V639S12BCI - Renesas Electronics

Description: The 70V639 is a high-speed 128K x 18 Asynchronous Dual-Port Static RAM designed to be used as a stand-alone Dual-Port RAM or as a combination MASTER/ SLAVE Dual-Port RAM for 36-bit-or-more word system. Using the IDT MASTER/SLAVE Dual-Port RAM approach in 36-bit or wider memory system applications results in full-speed, error-free operation without the need for additional discrete logic. An automatic power down feature controlled by the chip enables (either CE0 or CE1) permit the on-chip circuitry of each po

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PCB Footprints
70V639S12BCI - Renesas Electronics PCB footprint - BGA - BGA - BC256
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70V639S12BCI - Renesas Electronics  - 3D model - BGA - BC256
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70V639S12BCI Details

  • Manufacturer Part Number:

    70V639S12BCI

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CABGA

  • Package Description:

    17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256

  • Pin Count:

    256

  • Manufacturer Package Code:

    BC256

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    3

  • Access Time-Max:

    12 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e0

  • Length:

    17 mm

  • Memory Density:

    2359296 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    18

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    256

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128KX18

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    225

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Standby Current-Max:

    0.015 A

  • Standby Voltage-Min:

    3.15 V

  • Supply Current-Max:

    0.515 mA

  • Supply Voltage-Max (Vsup):

    3.45 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    17 mm

70V639S12BCI Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the 70V639S12BCI is -40°C to 85°C.
  • The 70V639S12BCI requires a clock signal with a frequency of 12 MHz to 40 MHz. You can use an external clock source or generate a clock signal using a crystal oscillator or a phase-locked loop (PLL).
  • The maximum current consumption of the 70V639S12BCI is 150 mA at 3.3V and 25°C.
  • The 70V639S12BCI can be programmed using a variety of methods, including in-circuit programming (ICP), in-system programming (ISP), and programming through a serial interface such as SPI or I2C.
  • The maximum frequency of the 70V639S12BCI is 40 MHz.

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