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7132LA20JG8 - Renesas Electronics

Description: The 7132 is a high-speed 2K x 8 Dual-Port Static RAM designed to be used as a stand-alone 8-bit Dual-Port RAM or as a "MASTER" Dual-Port RAM together with the 7142 "SLAVE" Dual-Port in 16-bit-or-more word width systems which would result in full-speed, error free operation without the need for additional discrete logic. An automatic power down feature, controlled by CE, permits the on chip circuitry of each port to enter a very low standby power mode. Military grade product in compliance with MIL-PRF-38535

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7132LA20JG8 - Renesas Electronics PCB footprint - Plastic Leaded Chip Carrier - Plastic Leaded Chip Carrier - PLG52-+-__
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7132LA20JG8 - Renesas Electronics  - 3D model - Plastic Leaded Chip Carrier - PLG52-+-__
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7132LA20JG8 Details

  • Manufacturer Part Number:

    7132LA20JG8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    PLCC

  • Pin Count:

    52

  • Manufacturer Package Code:

    PLG52

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    20 ns

  • Additional Feature:

    AUTOMATIC POWER DOWN

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PQCC-J52

  • JESD-609 Code:

    e3

  • Length:

    19.1262 mm

  • Memory Density:

    16384 bit

  • Memory IC Type:

    MULTI-PORT SRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    52

  • Number of Words:

    2048 words

  • Number of Words Code:

    2000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    2KX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCJ

  • Package Equivalence Code:

    LDCC52,.8SQ

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.572 mm

  • Standby Current-Max:

    0.0015 A

  • Standby Voltage-Min:

    2 V

  • Supply Current-Max:

    0.2 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    J BEND

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    19.1262 mm

7132LA20JG8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which includes thermal design considerations, such as thermal vias, copper pours, and component placement. It's essential to follow these guidelines to ensure optimal thermal performance and prevent overheating.
  • The power-up sequence and reset timing are critical for proper device operation. Renesas recommends following the power-up sequence and reset timing diagrams provided in the datasheet and application notes. Additionally, it's essential to ensure that the power supply voltage is stable and within the recommended range before applying the reset signal.
  • Renesas recommends using high-quality, low-ESR decoupling capacitors with a value of 0.1 μF to 1 μF, placed as close as possible to the device's power pins. The capacitors should be connected between the power pin and the ground pin, and their placement should be symmetrical to minimize noise and ensure stable operation.
  • To mitigate EMI, Renesas recommends using a multi-layer PCB with a solid ground plane, placing the device away from noise sources, and using shielding or filtering components, such as ferrite beads or common-mode chokes, on the I/O lines. Additionally, following good PCB design practices, such as minimizing trace lengths and using differential signaling, can help reduce EMI.
  • Thermal design considerations are crucial for the 7132LA20JG8. Renesas recommends using a heat sink or thermal pad to dissipate heat, especially in high-power applications. The device's thermal resistance (θJA) should be considered when designing the thermal management system. Additionally, ensuring good airflow and avoiding thermal obstacles around the device can help prevent overheating.

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7132LA20JG8 Overview

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