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71V3556S166PFGI - Renesas Electronics

Description: The 71V3556 3.3V CMOS Synchronous SRAM is organized as 128K x 36. It is designed to eliminate dead bus cycles when turning the bus around between reads and writes, or writes and reads. Thus, it has been given the name ZBTTM, or Zero Bus Turnaround. The 71V3556 contains data I/O, address and control signal registers.

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71V3556S166PFGI - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PKG100
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71V3556S166PFGI - Renesas Electronics  - 3D model - Quad Flat Packages - PKG100
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71V3556S166PFGI Details

  • Manufacturer Part Number:

    71V3556S166PFGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TQFP

  • Pin Count:

    100

  • Manufacturer Package Code:

    PKG100

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    3.5 ns

  • Clock Frequency-Max (fCLK):

    166 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Memory Density:

    4718592 bit

  • Memory IC Type:

    ZBT SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    100

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128KX36

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP100,.63X.87

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.045 A

  • Standby Voltage-Min:

    3.14 V

  • Supply Current-Max:

    0.36 mA

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

71V3556S166PFGI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application notes (e.g., AN983A) and design guides (e.g., DG201204). It's essential to follow these guidelines to ensure optimal performance, minimize noise, and reduce electromagnetic interference (EMI).
  • The 71V3556S166PFGI has a thermal junction-to-ambient resistance (RθJA) of 24°C/W. To manage thermal performance, ensure good airflow, use a heat sink if necessary, and follow Renesas' thermal design guidelines (e.g., AN983A).
  • Renesas recommends a specific power-on and power-off sequencing to prevent damage to the device. Refer to the datasheet and application notes (e.g., AN983A) for detailed information on power sequencing and voltage ramp-up/down requirements.
  • To ensure clock signal integrity and reduce jitter, follow Renesas' guidelines for clock signal routing, use a clock buffer or repeater if necessary, and implement proper termination and filtering techniques. Refer to the datasheet and application notes (e.g., AN983A) for more information.
  • The BIST feature is used to test the device's internal memory and logic. Refer to the datasheet and application notes (e.g., AN983A) for recommended settings and usage guidelines for the BIST feature.

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71V3556S166PFGI Overview

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