Part Image

71V67603S133PFGI - Renesas Electronics

Description: The 71V67603 3.3V CMOS SRAM is organized as 256K x 36. The 71V67603 SRAM contains write, data, address and control registers. The burst mode feature offers the highest level of performance to the system designer, as it can provide four cycles of data for a single address presented to the SRAM.The order of these three addresses are defined by the internal burst counter and the LBO input pin.

Download 71V67603S133PFGI Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
71V67603S133PFGI - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PKG100
click to zoom
3D Models
71V67603S133PFGI - Renesas Electronics  - 3D model - Quad Flat Packages - PKG100
click to zoom

71V67603S133PFGI Details

  • Manufacturer Part Number:

    71V67603S133PFGI

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TQFP

  • Pin Count:

    100

  • Manufacturer Package Code:

    PKG100

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Access Time-Max:

    4.2 ns

  • Additional Feature:

    PIPELINED ARCHITECTURE

  • Clock Frequency-Max (fCLK):

    133 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Memory Density:

    9437184 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    100

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256KX36

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP100,.63X.87

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.07 A

  • Standby Voltage-Min:

    3.14 V

  • Supply Current-Max:

    0.28 mA

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

71V67603S133PFGI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application notes (e.g., AN983A) and design guides (e.g., DG201204). It's essential to follow these guidelines to ensure optimal performance, minimize noise, and reduce electromagnetic interference (EMI).
  • The 71V67603S133PFGI has a thermal pad on the bottom of the package. Ensure good thermal contact between the pad and the PCB by using a thermal interface material (TIM) and a heat sink if necessary. Follow Renesas' thermal management guidelines (e.g., AN983A) and consider using thermal simulation tools to optimize your design.
  • The input capacitors should be low-ESR, high-frequency capacitors (e.g., ceramic or film capacitors) with a minimum capacitance of 10uF. The capacitors should be placed as close as possible to the device's power pins to minimize inductance and ensure stable operation.
  • Follow Renesas' guidelines for operating temperature range, voltage, and current. Ensure that your design takes into account the device's thermal characteristics, and consider using thermal protection circuits or thermal sensors to monitor the device's temperature.
  • Renesas provides detailed information on the configuration registers in the device's datasheet and application notes. It's essential to carefully review these resources and follow the recommended settings to ensure proper device operation and avoid potential issues.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

71V67603S133PFGI Overview

Use the download button to access the 71V67603S133PFGI schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 71V67, or try a keyword search, such as SRAMs

Parts related to 71V67603S133PFGI

Showing 0 results

71V67603S133PFGI Alternates

Showing results

Image Part Number Model
Part Image 71V67603S133PFGI Integrated Device Technology Inc

Standard SRAM, 256KX36, 4.2ns, CMOS, PQFP100

Part Image 71V67603ZS133PFGI Integrated Device Technology Inc

Standard SRAM, 256KX36, 4.2ns, CMOS, PQFP100

Part Image 71V67603S133PFI Integrated Device Technology Inc

Standard SRAM, 256KX36, 4.2ns, CMOS, PQFP100

Part Image IDT71V67603S133PFI8 Integrated Device Technology Inc

Cache SRAM, 256KX36, 4.2ns, CMOS, PQFP100

Part Image 71V67603ZS133PFGI Renesas Electronics Corporation

Standard SRAM, 256KX36, 4.2ns, CMOS, PQFP100

For a full list of alternate parts for 71V67603S133PFGI, check out Findchips.com