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72T36125L5BBI - Renesas Electronics

Description: The 72T36125 is a 256K x 36 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x36/x18/x9 data flow. TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode.

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PCB Footprints
72T36125L5BBI - Renesas Electronics PCB footprint - BGA - BGA - BB240
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72T36125L5BBI - Renesas Electronics  - 3D model - BGA - BB240
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72T36125L5BBI Details

  • Manufacturer Part Number:

    72T36125L5BBI

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PBGA

  • Pin Count:

    240

  • Manufacturer Package Code:

    BB240

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    3.6 ns

  • Additional Feature:

    ASYNCHRONOUS OPERATION ALSO POSSIBLE

  • Clock Frequency-Max (fCLK):

    200 MHz

  • Cycle Time:

    5 ns

  • JESD-30 Code:

    S-PBGA-B240

  • JESD-609 Code:

    e0

  • Length:

    19 mm

  • Memory Density:

    9437184 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    240

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256KX36

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA240,18X18,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    225

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.97 mm

  • Standby Current-Max:

    0.01 A

  • Supply Current-Max:

    0.06 mA

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    19 mm

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72T36125L5BBI Overview

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72T36125L5BBI Alternates

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Image Part Number Model
Part Image IDT72T36125L5BBG Integrated Device Technology Inc

FIFO, 256KX36, 3.6ns, Synchronous, CMOS, PBGA240

Part Image 72T36125L5BBG Renesas Electronics Corporation

256K x 36 TeraSync FIFO, 2.5V, PBGA84/Tray

Part Image 72T36125L5BBGI Renesas Electronics Corporation

FIFO, 256KX36, 3.6ns, Synchronous, CMOS, PBGA240

Part Image IDT72T36125L5BBI Renesas Electronics Corporation

FIFO, 256KX36, 3.6ns, Synchronous, CMOS, PBGA240

Part Image IDT72T36125L5BBG Renesas Electronics Corporation

FIFO, 256KX36, 3.6ns, Synchronous, CMOS, PBGA240

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