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72V01L25JGI8 - Renesas Electronics

Description: The 72V01 is a 512 x 9 dual-port FIFO that operates at Vcc between 3.0V and 3.6V. The device will load and empty data on a first-in/first-out basis. It uses Full and Empty flags to prevent data overflow and underflow. It has a Retransmit (RT) capability that allows for reset of the read pointer to its initial position when RT is pulsed LOW. It is designed for applications requiring asynchronous and simultaneous read/writes in multiprocessing and rate buffer applications.

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72V01L25JGI8 - Renesas Electronics PCB footprint - Plastic Leaded Chip Carrier - Plastic Leaded Chip Carrier - plg32
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72V01L25JGI8 - Renesas Electronics  - 3D model - Plastic Leaded Chip Carrier - plg32
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72V01L25JGI8 Details

  • Manufacturer Part Number:

    72V01L25JGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PLCC

  • Pin Count:

    32

  • Manufacturer Package Code:

    PLG32

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4

  • Access Time-Max:

    25 ns

  • Cycle Time:

    35 ns

  • JESD-30 Code:

    R-PQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    13.97 mm

  • Memory Density:

    4608 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    9

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of Words:

    512 words

  • Number of Words Code:

    512

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512X9

  • Output Characteristics:

    3-STATE

  • Output Enable:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCN

  • Package Equivalence Code:

    LCC32,.45X.55

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.79 mm

  • Standby Current-Max:

    0.005 A

  • Supply Current-Max:

    0.06 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    J BEND

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    11.43 mm

72V01L25JGI8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which can be found on their website. The guide includes thermal vias, copper pours, and other layout considerations to ensure optimal thermal performance.
  • Renesas recommends following the thermal design guidelines in the datasheet and application notes. Additionally, consider using thermal interface materials, heat sinks, and/or fans to maintain a safe operating temperature. Ensure that the device is operated within the specified temperature range and that the junction temperature (Tj) does not exceed the maximum rating.
  • The 72V01L25JGI8 has built-in ESD protection diodes on all pins, which can withstand up to ±2 kV according to the IEC61000-4-2 standard. For latch-up prevention, Renesas recommends following proper PCB design and layout guidelines, using a latch-up immune design, and ensuring that the device is operated within the specified voltage and current ranges.
  • Yes, the 72V01L25JGI8 is AEC-Q100 qualified, which means it meets the automotive industry's standards for reliability and performance. However, ensure that the device is used within the specified operating conditions and that the application meets the relevant automotive standards and regulations.
  • Renesas provides a recommended soldering profile in their packaging and assembly guidelines document, which can be found on their website. The profile includes temperature and time parameters for reflow soldering, wave soldering, and other assembly processes.

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