Part Image

72V3660L7-5PFGI8 - Renesas Electronics

Description: The 72V3660 4K x 36 SuperSync II FIFO memory with clocked read and write controls offers flexible Bus-Matching x36/x18/x9 data flow and Asynchronous/Synchronous translation on the read or write ports ; SuperSync II FIFO's are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes.

Download 72V3660L7-5PFGI8 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
72V3660L7-5PFGI8 - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - pkg128
click to zoom
3D Models
72V3660L7-5PFGI8 - Renesas Electronics  - 3D model - Quad Flat Packages - pkg128
click to zoom

72V3660L7-5PFGI8 Details

  • Manufacturer Part Number:

    72V3660L7-5PFGI8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TQFP

  • Pin Count:

    128

  • Manufacturer Package Code:

    PKG128

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    5 ns

  • Clock Frequency-Max (fCLK):

    133.3 MHz

  • Cycle Time:

    7.5 ns

  • JESD-30 Code:

    R-PQFP-G128

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Memory Density:

    147456 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    128

  • Number of Words:

    4096 words

  • Number of Words Code:

    4000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4KX36

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP128,.63X.87,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.015 A

  • Supply Current-Max:

    0.04 mA

  • Supply Voltage-Max (Vsup):

    3.45 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

72V3660L7-5PFGI8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which can be found on their website. The guide includes thermal vias, heat sink recommendations, and PCB layer stack-up suggestions to ensure optimal thermal performance.
  • Renesas provides a power sequencing guide in their datasheet and application notes. The device has a specific power-up and power-down sequence requirement, which involves controlling the voltage rails and clock signals to ensure proper operation and prevent damage.
  • Renesas recommends using high-quality, low-ESR decoupling capacitors with a value of 0.1uF to 1uF, placed as close as possible to the device's power pins. The capacitors should be rated for high-frequency operation and have a low inductance to minimize noise and voltage droop.
  • Renesas provides a JTAG interface guide in their datasheet and application notes. The device requires a specific JTAG adapter and software tools, such as Renesas' own E1 emulator or third-party tools like Segger J-Link, to access the device's internal registers and program the flash memory.
  • Renesas provides thermal design guidelines in their datasheet and application notes. The device has a maximum junction temperature (Tj) rating, and the system designer must ensure that the device operates within this rating by providing adequate heat sinking, airflow, and thermal interface materials.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

72V3660L7-5PFGI8 Overview

Use the download button to access the 72V3660L7-5PFGI8 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 72V36, or try a keyword search, such as FIFOs

Parts related to 72V3660L7-5PFGI8

Showing 0 results

72V3660L7-5PFGI8 Alternates

Showing results

Image Part Number Model
Part Image 72V3660L7-5PFG8 Renesas Electronics Corporation

FIFO, 4KX36, 5ns, Synchronous, CMOS, PQFP128

Part Image IDT72V3660L7-5PFI Integrated Device Technology Inc

Bi-Directional FIFO, 4KX36, 5ns, Synchronous, CMOS, PQFP128

Part Image IDT72V3660L6PF8 Integrated Device Technology Inc

FIFO, 4KX36, 4ns, Synchronous, CMOS, PQFP128

Part Image IDT72V3660L7-5PFGI8 Renesas Electronics Corporation

FIFO, 4KX36, 5ns, Synchronous, CMOS, PQFP128

Part Image IDT72V3660L6PF Integrated Device Technology Inc

FIFO, 4KX36, 4ns, Synchronous, CMOS, PQFP128

For a full list of alternate parts for 72V3660L7-5PFGI8, check out Findchips.com