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83026BMI-01LF - Renesas Electronics

Description: The 83026I-01 is a low skew, 1-to-2 Differential-to- LVCMOS/LVTTL Fanout Buffer. The differential input can accept most differential signal types (LVPECL, LVDS, LVHSTL, HCSL and SSTL) and translate to two single-ended LVCMOS/LVTTL outputs. The small 8-lead SOIC footprint makes this device ideal for use in applications with limited board space.

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83026BMI-01LF - Renesas Electronics - PCB symbol
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PCB Footprints
83026BMI-01LF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - (8 LD SOIC)
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83026BMI-01LF - Renesas Electronics - 3D model - Small Outline Packages - (8 LD SOIC)
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83026BMI-01LF Details

  • Manufacturer Part Number:

    83026BMI-01LF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Manufacturer Package Code:

    DCG8

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Family:

    83026

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    3.1 ns

  • Propagation Delay (tpd):

    3.1 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.015 ns

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

  • fmax-Min:

    350 MHz

83026BMI-01LF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • To ensure reliable operation across the entire operating temperature range, it is essential to follow the recommended operating conditions, including voltage, current, and power dissipation. Additionally, the device should be properly decoupled, and the PCB should be designed to minimize thermal gradients.
  • The critical timing parameters for the 83026BMI-01LF include clock frequency, setup and hold times, and output delay. To ensure these parameters are met, it is essential to follow the recommended clocking scheme, ensure proper signal routing, and use a reliable clock source.
  • To troubleshoot issues with the 83026BMI-01LF, it is essential to follow a systematic approach, including reviewing the system design, checking for power supply issues, and verifying the clocking scheme. Additionally, using debugging tools, such as logic analyzers or oscilloscopes, can help identify the root cause of the issue.
  • The recommended power-on sequence for the 83026BMI-01LF is to apply power to the core voltage (VCC) first, followed by the input/output voltage (VCCIO). The recommended power-off sequence is to remove power from the input/output voltage (VCCIO) first, followed by the core voltage (VCC).

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83026BMI-01LF Overview

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