Part Image

8533AGI-01LF - Renesas Electronics

Description: The 8533I-01 is a low skew, high performance 1-to-4 Differential-to-3.3V LVPECL Fanout Buffer. The 8533I-01 has two selectable clock inputs. The CLK, nCLK pair can accept most standard differential input levels. The PCLK, nPCLK pair can accept LVPECL, CML, or SSTL input levels. The clock enable is internally synchronized to eliminate runt pulses on the outputs during asynchronous assertion/deassertion of the clock enable pin. Guaranteed output and part-to-part skew characteristics make the 8533I-01 ideal fo

Download 8533AGI-01LF Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
8533AGI-01LF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - G Suffix for 20 Lead TSSOP
click to zoom
3D Models
8533AGI-01LF - Renesas Electronics  - 3D model - Small Outline Packages - G Suffix for 20 Lead TSSOP
click to zoom

8533AGI-01LF Details

  • Manufacturer Part Number:

    8533AGI-01LF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    PGG20

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Family:

    8533

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    52 mA

  • Prop. Delay@Nom-Sup:

    1.5 ns

  • Propagation Delay (tpd):

    1.5 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.03 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • fmax-Min:

    650 MHz

8533AGI-01LF Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow the PCB layout guidelines provided in the application note (ANXXXX) and ensure a minimum of 2oz copper thickness for the power planes. Additionally, a thermal pad with a thermal conductivity of at least 1 W/m-K is recommended for efficient heat dissipation.
  • To ensure EMC compliance, follow the guidelines outlined in the IEC 61000-4-x series of standards. Implement proper shielding, grounding, and filtering techniques, and ensure that the device is operated within the specified frequency range and power levels.
  • The recommended power-up sequence is to apply VCC first, followed by VDD, and then the input signals. For power-down, reverse the sequence. Ensure that the power supplies are ramped up and down slowly (typically 10-20 ms) to prevent damage to the device.
  • Handle the device in an ESD-controlled environment, wearing an ESD strap or wrist strap. Store the device in its original packaging or in a conductive bag with a humidity level below 60%. Avoid touching the device's pins or leads, and use an ESD mat or surface when handling the device.
  • The 8533AGI-01LF has a MTBF (Mean Time Between Failures) of >100,000 hours and a FIT (Failure In Time) rate of <10. The device is manufactured using a robust quality control process, ensuring a defect rate of <100 ppm.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

8533AGI-01LF Overview

Use the download button to access the 8533AGI-01LF schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 8533A, or try a keyword search, such as Clock Drivers

Parts related to 8533AGI-01LF

Showing 0 results

8533AGI-01LF Alternates

Showing results

Image Part Number Model
Part Image ICS8533AGI-01LFT Renesas Electronics Corporation

Low Skew Clock Driver, 4 True Output(s), 0 Inverted Output(s), PDSO20

Part Image 8533AGI-01LFT Integrated Device Technology Inc

Low Skew Clock Driver, 8533 Series, 4 True Output(s), 0 Inverted Output(s), PDSO20

Part Image 8533AGI-01LF Integrated Device Technology Inc

Low Skew Clock Driver, 8533 Series, 4 True Output(s), 0 Inverted Output(s), PDSO20

Part Image 8533AGI-01T Integrated Device Technology Inc

Low Skew Clock Driver, 8533 Series, 4 True Output(s), 0 Inverted Output(s), PDSO20

Part Image ICS8533AGI-01T Integrated Device Technology Inc

Low Skew Clock Driver, 4 True Output(s), 0 Inverted Output(s), PDSO20

For a full list of alternate parts for 8533AGI-01LF, check out Findchips.com