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8533AGI-01LFT - Renesas Electronics

Description: The 8533I-01 is a low skew, high performance 1-to-4 Differential-to-3.3V LVPECL Fanout Buffer. The 8533I-01 has two selectable clock inputs. The CLK, nCLK pair can accept most standard differential input levels. The PCLK, nPCLK pair can accept LVPECL, CML, or SSTL input levels. The clock enable is internally synchronized to eliminate runt pulses on the outputs during asynchronous assertion/deassertion of the clock enable pin. Guaranteed output and part-to-part skew characteristics make the 8533I-01 ideal fo

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8533AGI-01LFT - Renesas Electronics - PCB symbol
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8533AGI-01LFT - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PGG20
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8533AGI-01LFT - Renesas Electronics - 3D model - Small Outline Packages - PGG20
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8533AGI-01LFT Details

  • Manufacturer Part Number:

    8533AGI-01LFT

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    PGG20

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Family:

    8533

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    52 mA

  • Prop. Delay@Nom-Sup:

    1.5 ns

  • Propagation Delay (tpd):

    1.5 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.03 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • fmax-Min:

    650 MHz

8533AGI-01LFT Frequently Asked Questions (FAQs)

  • A multi-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the package for heat dissipation. A thermal pad on the bottom of the package should be connected to a solid ground plane or a thermal relief pattern.
  • Implement a robust power-on reset circuit, ensure a stable clock signal, and use a reliable voltage regulator. Also, consider using a temperature sensor to monitor the device temperature and adjust the system's operating parameters accordingly.
  • Use a multi-layer PCB with a solid ground plane, and ensure a low-impedance path to ground for the device's exposed pads. Implement EMI filters and shielding where necessary. For ESD protection, use TVS diodes or ESD protection devices on the I/O lines.
  • Use the device's power-down modes, adjust the clock frequency, and optimize the system's power management strategy. Consider using a low-dropout regulator and a power-gating technique to minimize power consumption.
  • Implement error correction mechanisms, such as ECC or CRC, to detect and correct data errors. Use a robust communication protocol, and consider using a watchdog timer to detect and recover from system failures.

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8533AGI-01LFT Overview

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