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8535AGI-01LF - Renesas Electronics

Description: The 8535I-01 is a low skew, high performance 1-to-4 LVCMOS/LVTTL-to-3.3V LVPECL fanout buffer. The 8535I-01 has two single ended clock inputs. the single ended clock input accepts LVCMOS or LVTTL input levels and translate them to 3.3V LVPECL levels. The clock enable is internally synchronized to eliminate runt clock pulses on the output during asynchronous assertion/ deassertion of the clock enable pin. Guaranteed output and part-to-part skew characteristics make the 8535I-01 ideal for those applications d

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8535AGI-01LF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PCG20-ren2
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8535AGI-01LF Details

  • Manufacturer Part Number:

    8535AGI-01LF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    PGG20

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Family:

    8535

  • Input Conditioning:

    MUX

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Inverted Outputs:

    4

  • Number of Terminals:

    20

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    50 mA

  • Prop. Delay@Nom-Sup:

    1.9 ns

  • Propagation Delay (tpd):

    1.9 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.03 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • fmax-Min:

    266 MHz

8535AGI-01LF Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow the PCB layout guidelines provided in the datasheet, ensuring a solid ground plane, and using thermal vias to dissipate heat. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended. Additionally, consider using thermal pads or heat sinks to dissipate heat.
  • To ensure EMC and reduce EMI, follow the recommended PCB layout, use a shielded enclosure, and consider adding EMI filters or ferrite beads to the power lines. Also, ensure proper grounding and decoupling of the device.
  • The recommended power-up sequence is to apply the analog power supply (VCC) first, followed by the digital power supply (VDD). For power-down, reverse the sequence. Ensure a minimum of 10ms delay between power-up and power-down sequences.
  • Use a voltage regulator with overvoltage protection (OVP) or a dedicated OVP IC to protect the device from voltage surges. A simple protection circuit can be implemented using a zener diode, resistor, and TVS diode.
  • The recommended operating conditions are: temperature range of -40°C to 125°C, and relative humidity of 60% or less. Ensure proper thermal management and consider using conformal coating or potting for high-humidity environments.

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8535AGI-01LF Overview

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