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853S011BMILF - Renesas Electronics

Description: The 853S011BI is a low skew, high performance 1-to-2 Differential-to-2.5V/3.3V LVPECL/ECL Fanout Buffer. The 853S011BI is characterized to operate from either a 2.5V or a 3.3V power supply. Guaranteed output and part-to-part skew characteristics make the 853S011BI ideal for those clock distribution applications demanding well defined performance and repeatability.

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853S011BMILF - Renesas Electronics - PCB symbol
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PCB Footprints
853S011BMILF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - Lead Free” 8 Lead SOIC
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853S011BMILF - Renesas Electronics - 3D model - Small Outline Packages - Lead Free” 8 Lead SOIC
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853S011BMILF Details

  • Manufacturer Part Number:

    853S011BMILF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Manufacturer Package Code:

    DCG8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Additional Feature:

    ALSO OPERATES AT 3.3V

  • Family:

    853

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    0.355 ns

  • Propagation Delay (tpd):

    0.355 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.02 ns

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    3.8 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

853S011BMILF Frequently Asked Questions (FAQs)

  • A multi-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the package for heat dissipation. A thermal pad on the bottom of the package should be connected to a thermal plane or a heat sink.
  • Use a shielded enclosure, keep signal lines short, and use a common mode choke or ferrite bead on the power lines. Ensure a solid ground plane and decouple power supplies. Follow the recommended layout guidelines in the datasheet.
  • Choose X7R or X5R ceramic capacitors with a voltage rating of at least 2x the maximum input voltage. For input capacitors, use 10uF to 22uF with an ESR of <1 ohm. For output capacitors, use 10uF to 47uF with an ESR of <2 ohms.
  • Use a current sense resistor and a comparator to monitor the output current. Implement a foldback current limit or a hiccup mode to prevent damage. Add a thermal shutdown circuit to prevent overheating.
  • Use a 4-wire Kelvin connection for accurate voltage and current measurements. Verify the output voltage, current, and power dissipation under various load conditions. Use an oscilloscope to measure the output ripple and noise.

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