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853S011CGILF - Renesas Electronics

Description: The 853S011CI is a low skew, high performance 1-to-2 Differential-to-2.5V/3.3V LVPECL/ECL Fanout Buffer. The 853S011CI is characterized to operate from either a 2.5V or a 3.3V power supply. Guaranteed output and part-to-part skew characteristics make the 853S011CI ideal for those clock distribution applications demanding well defined performance and repeatability.

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853S011CGILF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - DVG8
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853S011CGILF - Renesas Electronics  - 3D model - Small Outline Packages - DVG8
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853S011CGILF Details

  • Manufacturer Part Number:

    853S011CGILF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Pin Count:

    8

  • Manufacturer Package Code:

    DVG8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    ECL MODE SUPPLY VEE=-3.8 TO -2.375, WHERE VCC=0V

  • Family:

    853S

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    0.345 ns

  • Propagation Delay (tpd):

    0.19 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.02 ns

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    3.8 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

853S011CGILF Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APL-AN-1201) for thermal management. It suggests using a 4-layer PCB with a thermal vias array under the package, and a solid ground plane on the bottom layer to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow Renesas' recommended thermal design guidelines, including using a heat sink, thermal interface material, and ensuring good airflow. Additionally, consider using a thermistor or thermal sensor to monitor the device temperature.
  • Renesas recommends using a low-ESR ceramic capacitor (X5R or X7R dielectric) for CIN, with a value between 4.7uF to 10uF. For COUT, use a low-ESR ceramic or polymer capacitor with a value between 10uF to 22uF. The capacitor selection should be based on the specific application requirements and PCB layout.
  • To minimize EMI, follow Renesas' recommended layout guidelines, including keeping the input and output traces short and away from each other, using a solid ground plane, and placing the input capacitor close to the device. Additionally, consider using EMI filters or shielding to reduce radiation.
  • Renesas recommends using a pi-filter (L-C-R) or a simple RC filter at the input (VIN) to reduce noise and ripple. For the output (VOUT), use a simple RC filter or a pi-filter to reduce output noise and improve load transient response.

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