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853S014AGILF - Renesas Electronics

Description: The 853S014I is a low skew, high performance 1-to-5, 2.5V/3.3V Differential-to-LVPECL/ECL Fanout Buffer. The 853S014I has two selectable clock inputs. Guaranteed output and part-to-part skew characteristics make the 853S014I ideal for those applications demanding well defined performance and repeatability.

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853S014AGILF - Renesas Electronics - PCB symbol
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853S014AGILF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PCG20-ren2
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853S014AGILF - Renesas Electronics - 3D model - Small Outline Packages - PCG20-ren2
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853S014AGILF Details

  • Manufacturer Part Number:

    853S014AGILF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    20

  • Manufacturer Package Code:

    PGG20

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Additional Feature:

    IT OPERATES -3.8V TO -2.375V AT ECL MODE

  • Family:

    853S

  • Input Conditioning:

    DIFFERENTIAL MUX

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Number of True Outputs:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    0.5 ns

  • Propagation Delay (tpd):

    0.5 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.055 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.8 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • fmax-Min:

    2000 MHz

853S014AGILF Frequently Asked Questions (FAQs)

  • A multi-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the package for airflow and heat dissipation. A thermal pad on the bottom of the package should be connected to a thermal plane on the PCB.
  • Use a shielded enclosure, keep signal lines short, and use a common mode choke or ferrite bead on the power lines. Ensure a solid ground plane and decouple power supplies. Follow the recommended layout guidelines in the datasheet.
  • The recommended input power supply voltage is 3.3V ± 10%. Use a low-dropout linear regulator or a switching regulator with a high power supply rejection ratio (PSRR) to ensure a stable voltage supply. Add decoupling capacitors close to the device pins.
  • Use a high-quality crystal oscillator or a low-jitter clock source. Ensure the clock signal is properly terminated and routed. Use a clock buffer or a clock distribution network to minimize skew and jitter.
  • Use high-quality, low-ESR capacitors (e.g., X7R or X5R) for decoupling and filtering. Choose resistors with a low temperature coefficient (e.g., 1%) and a high power rating. Follow the recommended component values and tolerances in the datasheet.

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853S014AGILF Overview

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