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853S12AKILF - Renesas Electronics

Description: The 853S12I is a low skew, 1-to-12 Differential-to- 3.3V, 2.5V LVPECL Fanout Buffer and a member of the HiPerClockS™ family of High Performance Clock Solutions from IDT. The PCLK, nPCLK pair accepts LVPECL, CML, and SSTL differential input levels. The high gain differential amplifier accepts peak-to-peak input voltages as small as 150mV, as long as the common mode voltage is within the specified minimum and maximum range. Guaranteed output and part-to-part skew characteristics make the 853S12I ideal for tho

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853S12AKILF - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - NLG32P1-8
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853S12AKILF - Renesas Electronics  - 3D model - Quad Flat No-Lead - NLG32P1-8
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853S12AKILF Details

  • Manufacturer Part Number:

    853S12AKILF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    VFQFPN

  • Package Description:

    LCC-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    NLG32P1

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Additional Feature:

    ALSO OPERATES AT 3.3V SUPPLY

  • Family:

    853S

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of True Outputs:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    137 mA

  • Prop. Delay@Nom-Sup:

    0.68 ns

  • Propagation Delay (tpd):

    0.68 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.05 ns

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

  • fmax-Min:

    1500 MHz

853S12AKILF Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note '853S12AKILF Thermal Design Guide' (document number R01AN4301EJ0100). It includes guidelines for thermal vias, heat sink design, and PCB layer stack-up.
  • Renesas provides a Secure Boot and Firmware Encryption Guide (document number R01AN4302EJ0100) that outlines the steps to implement secure boot and firmware encryption using the 853S12AKILF's built-in security features, such as the Trusted Secure IP (TSIP) and the Advanced Encryption Standard (AES).
  • The internal oscillator has a typical frequency accuracy of ±2% at room temperature. To improve accuracy, you can use an external crystal oscillator or a ceramic resonator. Renesas recommends using a high-quality crystal oscillator with a frequency tolerance of ±10 ppm or better.
  • Renesas provides a Power Management Guide (document number R01AN4303EJ0100) that outlines techniques for optimizing power consumption in low-power modes, including sleep modes, stop modes, and low-power clock modes. Additionally, you can use the 853S12AKILF's built-in power management features, such as the Power Management Controller (PMC) and the Low-Power Mode Controller (LPMC).
  • Renesas provides an EMC/EMI Design Guide (document number R01AN4304EJ0100) that outlines considerations for designing EMC- and EMI-compliant systems using the 853S12AKILF. The guide covers topics such as PCB layout, component selection, and shielding.

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853S12AKILF Overview

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