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89H48H12G2ZCBLG - Renesas Electronics

Description: Provides 48 PCIe Gen2 lanes and 12 ports of high-performance, deterministic system interconnect switching. All ports receive full line rate, non-blocking throughput for multiple traffic flows regardless of switch loading.

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89H48H12G2ZCBLG - Renesas Electronics PCB footprint - BGA - BGA - BGA 27 X 27 MM 1.0 MM PITCH
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89H48H12G2ZCBLG - Renesas Electronics  - 3D model - BGA - BGA 27 X 27 MM 1.0 MM PITCH
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89H48H12G2ZCBLG Details

  • Manufacturer Part Number:

    89H48H12G2ZCBLG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    FCBGA

  • Package Description:

    BGA-676

  • Pin Count:

    676

  • Manufacturer Package Code:

    BLG676

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Bus Compatibility:

    I2C; ISA; VGA; SMBUS

  • Clock Frequency-Max:

    125 MHz

  • Data Transfer Rate-Max:

    48 MBps

  • Drive Interface Standard:

    IEEE 1149.6AC; IEEE 1149.1

  • JESD-30 Code:

    S-PBGA-B676

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    676

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA676,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.22 mm

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    27 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

89H48H12G2ZCBLG Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APL-AN-1201) which includes thermal design considerations, such as thermal vias, copper pours, and component placement.
  • Renesas recommends a specific power sequencing scheme in their datasheet, which involves powering up the VCC and VDD pins in a specific order. Additionally, they provide a power sequencing diagram in their application note (APL-AN-1202).
  • Renesas recommends using high-frequency, low-ESR capacitors (e.g., 100nF, 1uF, and 10uF) with a voltage rating of 2.5V or higher, placed as close as possible to the power pins. The exact values and placement can be found in the datasheet and application notes.
  • Renesas provides a JTAG interface specification in their datasheet, which includes pinouts, signal levels, and protocol information. Additionally, they offer a JTAG programming guide (APL-AN-1203) that covers testing and programming procedures.
  • Renesas provides thermal design guidelines in their application note (APL-AN-1201), which include thermal resistance values, junction-to-case thermal resistance, and recommended thermal interface materials. Engineers should also consider using thermal simulation tools to optimize their design.

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89H48H12G2ZCBLG Overview

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