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89HPES24T3G2ZCALG - Renesas Electronics

Description: Provides high-performance I/O expansion and switching functions between a PCIe upstream port and two downstream ports or peer-to-peer switching between downstream ports.

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89HPES24T3G2ZCALG - Renesas Electronics PCB footprint - BGA - BGA - ALG324
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89HPES24T3G2ZCALG - Renesas Electronics  - 3D model - BGA - ALG324
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89HPES24T3G2ZCALG Details

  • Manufacturer Part Number:

    89HPES24T3G2ZCALG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    FCBGA

  • Package Description:

    FCBGA-324

  • Pin Count:

    324

  • Manufacturer Package Code:

    ALG324

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Bus Compatibility:

    PCI, SMBUS

  • Clock Frequency-Max:

    125 MHz

  • Data Transfer Rate-Max:

    625 MBps

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA324,18X18,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.42 mm

  • Supply Current-Max:

    1260 mA

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    0.9 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    19 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

89HPES24T3G2ZCALG Frequently Asked Questions (FAQs)

  • Renesas provides a reference design guide for PCB layout and thermal management, which includes recommendations for component placement, thermal vias, and heat sink design. It's essential to follow these guidelines to ensure optimal performance and prevent overheating.
  • Renesas recommends using a power management IC (PMIC) specifically designed for the 89HPES24T3G2ZCALG. The PMIC should be able to provide the required voltage rails, power sequencing, and voltage regulation. Renesas provides a list of recommended PMICs and application notes for power management.
  • The 89HPES24T3G2ZCALG requires a high-quality clock signal with specific frequency, amplitude, and jitter requirements. Renesas recommends using a clock generator or oscillator that meets these requirements. Additionally, it's essential to ensure clock signal integrity by using proper PCB layout, routing, and termination techniques.
  • Renesas provides guidelines for power optimization, including recommendations for clock gating, power gating, and voltage scaling. Additionally, engineers can use power-saving modes, such as sleep mode or standby mode, to minimize standby current. Renesas also recommends using a power management IC to optimize power consumption.
  • The 89HPES24T3G2ZCALG requires a specific memory interface configuration, including memory type, speed, and timing. Renesas recommends using a memory interface controller or a dedicated memory IC that meets these requirements. Additionally, engineers should ensure data integrity by using error correction codes, such as ECC, and implementing proper data buffering and synchronization techniques.

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89HPES24T3G2ZCALG Overview

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