Description:The 9DB233 zero-delay buffer supports PCIe Gen3 requirements, while being backwards compatible to PCIe Gen2 and Gen1. The 9DB233 is driven by a differential SRC output pair from an IDT 932S421 or 932SQ420 or equivalent main clock generator. It attenuates jitter on the input clock and has a selectable PLL bandwidth to maximize performance in systems with or without Spread-Spectrum clocking. An SMBus interface allows control of the PLL bandwidth and bypass options, while 2 clock request (OE#) pins make the 9D
Renesas provides a recommended PCB layout guide in their application note (AN1844) for the 9DB233AGILFT. It suggests using a 4-layer PCB with a dedicated thermal layer, and placing thermal vias under the package to improve heat dissipation.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and consider using a heat sink or fan for cooling. Additionally, ensure that the device is operated within its specified temperature range (-40°C to 125°C).
The input capacitor (CIN) should be a low-ESR ceramic capacitor with a value between 4.7 μF to 10 μF, and the output capacitor (COUT) should be a low-ESR ceramic capacitor with a value between 10 μF to 22 μF. The capacitors should be placed close to the device and have a low inductance path to the device pins.
To minimize EMI, keep the switching node (SW) and input/output tracks as short as possible, and use a solid ground plane to reduce radiation. Additionally, use a shielded cable or a twisted pair for the input and output connections, and consider adding EMI filters or common-mode chokes if necessary.
The bootstrap capacitor (CBST) should be a low-ESR ceramic capacitor with a value between 100 nF to 1 μF, and should be placed close to the BST pin. The capacitor should be rated for a voltage of at least 5 V and should have a low inductance path to the BST pin.
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9DB233AGILFT Overview
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