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9FG108EGILFT - Renesas Electronics

Description: 9FG108 is a Synthesizer that provides 8 differential output pairs that are compliant to the Intel CK410 specification. It also provides support for PCI-Express, next generation I/O, and SATA. The part synthesizes several output frequencies from either a 14.31818 MHz crystal or a 25 MHz crystal. The device can also be driven by a reference input clock instead of a crystal. It provides outputs with cycle-to-cycle jitter of less than 50 ps and output-to-output skew of less than 65 ps.

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9FG108EGILFT - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PAG48, 48-pin TSSOP
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9FG108EGILFT - Renesas Electronics  - 3D model - Small Outline Packages - PAG48, 48-pin TSSOP
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9FG108EGILFT Details

  • Manufacturer Part Number:

    9FG108EGILFT

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    PAG48

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e3

  • Length:

    12.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Clock Frequency-Max:

    400 MHz

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Primary Clock/Crystal Frequency-Nom:

    28 MHz

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    225 mA

  • Supply Voltage-Max:

    3.465 V

  • Supply Voltage-Min:

    3.135 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

  • uPs/uCs/Peripheral ICs Type:

    CLOCK GENERATOR, PROCESSOR SPECIFIC

9FG108EGILFT Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The datasheet provides a recommended land pattern, but additional thermal design considerations should be taken into account.
  • To ensure reliable operation across the entire operating temperature range, it is essential to follow the recommended operating conditions, including voltage, current, and power dissipation. Additionally, consider using thermal management techniques, such as heat sinks or thermal interfaces, to maintain a safe junction temperature.
  • When using the 9FG108EGILFT in a high-reliability or safety-critical application, it is essential to follow the recommended design and testing guidelines to ensure the device meets the required safety and reliability standards. This may include additional testing, such as environmental stress screening, and adherence to industry-specific standards, such as IEC 61508 or ISO 26262.
  • To troubleshoot issues related to the 9FG108EGILFT's power management features, use a combination of oscilloscope measurements, voltage and current monitoring, and debug tools, such as Renesas' e² studio or other third-party tools. Consult the datasheet and application notes for specific guidance on troubleshooting power management issues.
  • When using the 9FG108EGILFT in a system with multiple power domains, ensure that each power domain is properly isolated and decoupled to prevent noise and interference. Follow the recommended power sequencing and voltage ramp-up procedures to prevent damage to the device or other system components.

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9FG108EGILFT Overview

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Part Image 9FG108EGILF Renesas Electronics Corporation

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Part Image 9FG108EGLFT Renesas Electronics Corporation

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Part Image 9FG108EGLF Renesas Electronics Corporation

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Part Image 9FG108EGLF Integrated Device Technology Inc

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Part Image 9FG108EGILFT Integrated Device Technology Inc

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