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A1P50S65M2 - STMicroelectronics

Description: Trans IGBT Module N-CH 650V 50A 208000mW 22-Pin ACEPACK-1 Tray

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A1P50S65M2 - STMicroelectronics  - 3D model
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A1P50S65M2 Details

  • Manufacturer Part Number:

    A1P50S65M2

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2018-02-19

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    5.35

  • Case Connection:

    ISOLATED

  • Collector Current-Max (IC):

    50 A

  • Collector-Emitter Voltage-Max:

    650 V

  • Configuration:

    COMPLEX

  • Gate-Emitter Thr Voltage-Max:

    7 V

  • Gate-Emitter Voltage-Max:

    20 V

  • JESD-30 Code:

    R-XUFM-X22

  • Number of Elements:

    6

  • Number of Terminals:

    22

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    208 W

  • Surface Mount:

    NO

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    331 ns

  • Turn-on Time-Nom (ton):

    167.2 ns

  • VCEsat-Max:

    2.3 V

A1P50S65M2 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the thermal pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider using a heat sink or a thermal management system.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, decreased performance, and even permanent damage to the device. It's crucial to ensure the device operates within the recommended temperature range to maintain reliability and performance.
  • To prevent ESD damage, handle the device in an ESD-protected environment, use ESD-protective packaging, and ensure that all personnel handling the device are grounded. During assembly, use ESD-protective tools and follow proper handling procedures.
  • Store the device in a dry, cool place, away from direct sunlight and moisture. Avoid exposing the device to extreme temperatures, humidity, or physical stress. Follow the recommended storage and handling procedures outlined in the datasheet.

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A1P50S65M2 Overview

Use the download button to access the A1P50S65M2 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like A1P50, or try a keyword search, such as IGBTs

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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