17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256
HTS Code:
8542.31.00.60
Manufacturer:
Microsemi Corporation (now Microchip)
Clock Frequency-Max:
350 MHz
JESD-30 Code:
S-PBGA-B256
JESD-609 Code:
e1
Length:
17 mm
Moisture Sensitivity Level:
3
Number of CLBs:
24576
Number of Equivalent Gates:
1000000
Number of Terminals:
256
Operating Temperature-Max:
85 °C
Organization:
24576 CLBS, 1000000 GATES
Package Body Material:
PLASTIC/EPOXY
Package Code:
BGA
Package Equivalence Code:
BGA256,16X16,40
Package Shape:
SQUARE
Package Style:
GRID ARRAY
Peak Reflow Temperature (Cel):
250
Programmable Logic Type:
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status:
Not Qualified
Seated Height-Max:
1.8 mm
Supply Voltage-Max:
1.575 V
Supply Voltage-Min:
1.425 V
Supply Voltage-Nom:
1.5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
COMMERCIAL
Terminal Finish:
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form:
BALL
Terminal Pitch:
1 mm
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
30
Width:
17 mm
A3P1000-FGG256 Frequently Asked Questions (FAQs)
Microsemi provides a PCB design guide that recommends a 6-layer stackup with a dedicated power plane, a dedicated ground plane, and signal layers with a minimum of 5 mils of spacing between signals. Additionally, it's recommended to use a 50-ohm impedance-controlled routing for high-speed signals.
Microsemi recommends using an external POR circuit with a voltage supervisor IC, such as the TLV7031, to ensure a reliable and efficient POR. The POR circuit should be designed to provide a minimum of 10 ms of reset pulse width and a maximum of 100 ms of reset timeout.
Microsemi recommends using a heat sink with a thermal interface material (TIM) to dissipate heat from the FPGA. The heat sink should be designed to provide a thermal resistance of less than 10°C/W, and the TIM should have a thermal conductivity of at least 1 W/m-K. Additionally, it's recommended to provide adequate airflow around the FPGA to prevent thermal hotspots.
Microsemi recommends using a reliable configuration interface, such as JTAG or SPI, and ensuring that the configuration data is error-free and correctly formatted. Additionally, it's recommended to use a secure boot mechanism, such as AES encryption, to prevent unauthorized access to the FPGA configuration.
The A3P1000-FGG256 FPGA has built-in PLLs and clock management units that can be used to generate and manage clock signals. However, there are limitations on the number of PLLs available, and the clock management units have limited flexibility. It's recommended to carefully plan and design the clock architecture to ensure that it meets the system requirements.
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A3P1000-FGG256 Overview
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