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A3PE3000-FGG484 - Microsemi Corporation

Description: FPGA ProASIC®3E Family 3M Gates 231MHz 130nm Technology 1.5V 484-Pin FBGA Tray

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A3PE3000-FGG484 - Microsemi Corporation PCB footprint - BGA - BGA - FG484
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A3PE3000-FGG484 - Microsemi Corporation  - 3D model - BGA - FG484
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A3PE3000-FGG484 Details

  • Manufacturer Part Number:

    A3PE3000-FGG484

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Clock Frequency-Max:

    350 MHz

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    75264

  • Number of Equivalent Gates:

    3000000

  • Number of Inputs:

    341

  • Number of Logic Cells:

    75264

  • Number of Outputs:

    341

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    70 °C

  • Organization:

    75264 CLBS, 3000000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.44 mm

  • Supply Voltage-Max:

    1.575 V

  • Supply Voltage-Min:

    1.425 V

  • Supply Voltage-Nom:

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

A3PE3000-FGG484 Frequently Asked Questions (FAQs)

  • Microsemi provides a PCB design guide that includes layout and routing guidelines for the A3PE3000-FGG484. It's recommended to follow these guidelines to ensure signal integrity and minimize electromagnetic interference (EMI).
  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the Microsemi MIC2777, which provides a reset signal to the FPGA during power-up. The POR circuit should be designed to ensure that the FPGA is held in reset until the power supply voltages are stable.
  • The A3PE3000-FGG484 has a maximum junction temperature of 100°C. To ensure reliable operation, it's essential to implement proper thermal management, including heat sinks, thermal interfaces, and airflow management. Microsemi provides thermal modeling and simulation tools to help with thermal design.
  • Microsemi provides a range of security features, including bitstream encryption, secure boot, and anti-tamper protection. Additionally, designers can implement their own security measures, such as secure key storage and access control, to protect their IP.
  • The A3PE3000-FGG484 is designed to be radiation-tolerant, but SEU mitigation strategies are still necessary. Designers can use techniques such as triple modular redundancy, error correction codes, and scrubbing to mitigate SEU effects.

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A3PE3000-FGG484 Overview

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Part Image A3PE3000-FGG484 Microchip Technology Inc

Field Programmable Gate Array, 75264 CLBs, 3000000 Gates, 350MHz, 75264-Cell, CMOS, PBGA484

Part Image A3PE3000-FG484 Microchip Technology Inc

Field Programmable Gate Array, 75264 CLBs, 3000000 Gates, 350MHz, 75264-Cell, CMOS, PBGA484