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ADP1031ACPZ-1-R7 - Analog Devices

Description: Power Management Specialized - PMIC Iso uPMU & Digi 5.15Vout2

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ADP1031ACPZ-1-R7 - Analog Devices  - 3D model
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ADP1031ACPZ-1-R7 Details

  • Manufacturer Part Number:

    ADP1031ACPZ-1-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFCSP-41

  • Pin Count:

    41

  • Manufacturer Package Code:

    CP-41-1

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2019-01-31

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    R-XQCC-N41

  • JESD-609 Code:

    e4

  • Length:

    9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    41

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC41,.27X.35,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    60 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    24 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Threshold Voltage-Nom:

    4.4

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

ADP1031ACPZ-1-R7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADP1031ACPZ-1-R7 involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the input and output traces. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the input and output capacitors are of high quality and have low ESR. Additionally, the device should be operated within its recommended operating conditions, and the input voltage should be well-regulated.
  • The ADP1031ACPZ-1-R7 is rated for operation from -40°C to +125°C. However, the device's performance may degrade at higher temperatures, and the maximum junction temperature should not exceed 150°C.
  • Yes, the ADP1031ACPZ-1-R7 is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q100 standard and is suitable for use in harsh environments.
  • To troubleshoot issues with the ADP1031ACPZ-1-R7, start by checking the input voltage, output voltage, and current. Verify that the device is operated within its recommended operating conditions. Check for any signs of overheating, and ensure that the PCB layout and component selection meet the recommended guidelines.

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ADP1031ACPZ-1-R7 Overview

Use the download button to access the ADP1031ACPZ-1-R7 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like ADP10, or try a keyword search, such as Power Management Circuits

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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