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APA1000-PQG208I - Microsemi Corporation

Description: IC FPGA 158 I/O 208QFP

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APA1000-PQG208I - Microsemi Corporation - PCB symbol
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PCB Footprints
APA1000-PQG208I - Microsemi Corporation PCB footprint - Quad Flat Packages - Quad Flat Packages - 208 PQFP
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APA1000-PQG208I - Microsemi Corporation - 3D model - Quad Flat Packages - 208 PQFP
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APA1000-PQG208I Details

  • Manufacturer Part Number:

    APA1000-PQG208I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, QFP-208

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Clock Frequency-Max:

    180 MHz

  • JESD-30 Code:

    S-PQFP-G208

  • JESD-609 Code:

    e3

  • Length:

    28 mm

  • Moisture Sensitivity Level:

    3

  • Number of Equivalent Gates:

    1000000

  • Number of Inputs:

    158

  • Number of Logic Cells:

    56320

  • Number of Outputs:

    158

  • Number of Terminals:

    208

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1000000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FQFP

  • Package Equivalence Code:

    QFP208,1.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, FINE PITCH

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.1 mm

  • Supply Voltage-Max:

    2.7 V

  • Supply Voltage-Min:

    2.3 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    28 mm

APA1000-PQG208I Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The APA1000-PQG208I should be placed near a thermal pad or heat sink to ensure efficient heat dissipation.
  • Ensure that the device is operated within the recommended voltage and current specifications, and that the PCB is designed to minimize thermal resistance. Additionally, consider using thermal interface materials and heat sinks to improve heat dissipation.
  • Not using the recommended input capacitance values may result in reduced stability, increased noise, and decreased overall performance. It is recommended to follow the datasheet guidelines for input capacitance values to ensure optimal performance.
  • While the APA1000-PQG208I is designed for isolated applications, it can be used in non-isolated applications with proper design considerations. However, this may require additional components and design modifications to ensure safe and reliable operation.
  • The APA1000-PQG208I is designed to meet CISPR 22 and FCC Part 15 Class B emissions standards. However, proper PCB layout, shielding, and filtering may be required to ensure compliance with specific EMI and RFI regulations.

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APA1000-PQG208I Overview

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APA1000-PQG208I Alternates

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Image Part Number Model
Part Image APA1000-PQG208M Microsemi Corporation (now Microchip)

Field Programmable Gate Array, 1000000 Gates, 180MHz, 56320-Cell, CMOS, PQFP208
Part Image APA1000-PQG208M Actel Corporation

Field Programmable Gate Array, 1000000 Gates, 180MHz, 56320-Cell, CMOS, PQFP208
Part Image APA1000-PQG208I Actel Corporation

Field Programmable Gate Array, 1000000 Gates, 180MHz, 56320-Cell, CMOS, PQFP208
Part Image APA1000-PQG208 Microchip Technology Inc

Field Programmable Gate Array, 1000000 Gates, 180MHz, 56320-Cell, CMOS, PQFP208
Part Image APA1000-PQ208 Microsemi Corporation (now Microchip)

Field Programmable Gate Array, 1000000 Gates, 180MHz, 56320-Cell, CMOS, PQFP208
For a full list of alternate parts for APA1000-PQG208I, check out Findchips.com