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APA300-PQG208 - Microsemi Corporation

Description: IC FPGA 158 I/O 208QFP

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APA300-PQG208 - Microsemi Corporation - PCB symbol
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APA300-PQG208 - Microsemi Corporation PCB footprint - Quad Flat Packages - Quad Flat Packages - A54SX72A-1PQG208I
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APA300-PQG208 - Microsemi Corporation - 3D model - Quad Flat Packages - A54SX72A-1PQG208I
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APA300-PQG208 Details

  • Manufacturer Part Number:

    APA300-PQG208

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, QFP-208

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Clock Frequency-Max:

    180 MHz

  • JESD-30 Code:

    S-PQFP-G208

  • JESD-609 Code:

    e3

  • Length:

    28 mm

  • Moisture Sensitivity Level:

    3

  • Number of Equivalent Gates:

    300000

  • Number of Inputs:

    158

  • Number of Logic Cells:

    8192

  • Number of Outputs:

    158

  • Number of Terminals:

    208

  • Operating Temperature-Max:

    70 °C

  • Organization:

    300000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FQFP

  • Package Equivalence Code:

    QFP208,1.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, FINE PITCH

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.1 mm

  • Supply Voltage-Max:

    2.7 V

  • Supply Voltage-Min:

    2.3 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    28 mm

APA300-PQG208 Frequently Asked Questions (FAQs)

  • Microsemi recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A thermal pad on the bottom of the package should be connected to a heat sink or a thermal interface material.
  • Implement a robust thermal management system, ensure good airflow, and consider using a heat sink or thermal interface material. Also, follow the recommended operating conditions and derating guidelines in the datasheet.
  • Use proper shielding, grounding, and decoupling techniques to minimize EMI and RFI. Ensure that the PCB layout and component placement follow good electromagnetic compatibility (EMC) practices.
  • The APA300-PQG208 is not specifically designed for radiation-hardened applications. However, Microsemi offers radiation-hardened versions of similar products. Contact Microsemi for more information on their radiation-hardened product offerings.
  • Follow the recommended soldering and assembly guidelines in the datasheet, and use a qualified assembly house or trained personnel. Ensure that the soldering process meets the requirements for lead-free soldering.

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APA300-PQG208 Overview

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APA300-PQG208 Alternates

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Image Part Number Model
Part Image APA300-PQG208I Actel Corporation

Field Programmable Gate Array, 300000 Gates, 180MHz, 8192-Cell, CMOS, PQFP208
Part Image APA300-PQ208I Actel Corporation

Field Programmable Gate Array, 300000 Gates, 180MHz, 8192-Cell, CMOS, PQFP208
Part Image APA300-PQG208I Microchip Technology Inc

Field Programmable Gate Array, 300000 Gates, 180MHz, 8192-Cell, CMOS, PQFP208
Part Image APA300-PQ208M Microsemi Corporation (now Microchip)

Field Programmable Gate Array, 300000 Gates, 180MHz, 8192-Cell, CMOS, PQFP208
Part Image APA300-PQG208 Microchip Technology Inc

Field Programmable Gate Array, 300000 Gates, 180MHz, 8192-Cell, CMOS, PQFP208
For a full list of alternate parts for APA300-PQG208, check out Findchips.com