AS4C64M16D2A-25BCN - Alliance Memory

AS4C64M16D2A-25BCN Details

• Manufacturer Part Number:

  AS4C64M16D2A-25BCN

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  FBGA-84

• Country Of Origin:

  Taiwan

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.32

• Factory Lead Time:

  8 Weeks

• Manufacturer:

  Alliance Memory Inc

• YTEOL:

  4

• Access Mode:

  MULTI BANK PAGE BURST

• Additional Feature:

  AUTO/SELF REFRESH

• JESD-30 Code:

  R-PBGA-B84

• JESD-609 Code:

  e1

• Length:

  12.5 mm

• Memory Density:

  1073741824 bit

• Memory IC Type:

  DDR2 DRAM

• Memory Width:

  16

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Ports:

  1

• Number of Terminals:

  84

• Number of Words:

  67108864 words

• Number of Words Code:

  64000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  64MX16

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TFBGA

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  265

• Seated Height-Max:

  1.2 mm

• Self Refresh:

  YES

• Supply Voltage-Max (Vsup):

  1.9 V

• Supply Voltage-Min (Vsup):

  1.7 V

• Supply Voltage-Nom (Vsup):

  1.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  TIN SILVER COPPER

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  20

• Width:

  8 mm