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BFR31 - NXP

Description: RF Bipolar Transistors BFR31/TO-236AB///REEL 11 Q3/T4*STANDARD MARK SMDL

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BFR31 - NXP - PCB symbol
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PCB Footprints
BFR31 - NXP PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - Plastic surface-mounted package; 3 leads
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BFR31 - NXP - 3D model - SOT23 (3-Pin) - Plastic surface-mounted package; 3 leads
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BFR31 Details

  • Manufacturer Part Number:

    BFR31

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23

  • Package Description:

    PLASTIC PACKAGE-3

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00

  • Date Of Intro:

    1990-12-26

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Configuration:

    SINGLE

  • DS Breakdown Voltage-Min:

    25 V

  • Drain Current-Max (ID):

    0.01 A

  • FET Technology:

    JUNCTION

  • Feedback Cap-Max (Crss):

    1.5 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.3 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

BFR31 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN11555, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The choice of external components, such as resistors, capacitors, and inductors, depends on the specific application and operating frequency. NXP provides a component selection guide in the application note AN11555, which includes recommendations for component values and types.
  • The maximum power handling capability of the BFR31 depends on the operating frequency, voltage, and current. According to the datasheet, the device can handle up to 31 dBm of output power, but this may vary depending on the specific application and thermal management. It's recommended to consult with NXP's application engineers for specific guidance.
  • Impedance matching is critical for optimal performance of the BFR31. NXP provides guidelines for impedance matching in the application note AN11555, which includes recommendations for using resistive pi-networks or LC networks to match the device's input and output impedances to the system's impedance.
  • Thermal management is crucial for the BFR31, as it can operate at high temperatures. NXP recommends using a heat sink or thermal pad to dissipate heat, and provides guidelines for thermal management in the application note AN11555. The device's thermal resistance (Rth) is specified in the datasheet.

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BFR31 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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