3D Models
Note! To download footprints and symbols, use the build and request forms below
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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for BSM50GP60
- Part Number BSM50GP60
- Manufacturer Infineon
- Pin Count 24
- Last Modified Date Jan 7, 2025 9:14 AM UTC
- Pinout / Pin List Click Here (Member Only)
BSM50GP60 Details
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Manufacturer Part Number:
BSM50GP60
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Rohs Code:
Yes
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Part Life Cycle Code:
Obsolete
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Part Package Code:
MODULE
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Pin Count:
24
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ECCN Code:
EAR99
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Manufacturer:
Infineon Technologies AG
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YTEOL:
0
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Case Connection:
ISOLATED
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Collector Current-Max (IC):
70 A
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Collector-Emitter Voltage-Max:
600 V
BSM50GP60 Frequently Asked Questions (FAQs)
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The maximum allowed voltage imbalance between the DC links is ±10% of the nominal DC voltage. Exceeding this limit may lead to uneven current sharing and reduced module lifetime.
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Proper thermal management involves ensuring good heat sink contact, using a suitable thermal interface material, and maintaining a maximum junction temperature of 150°C. A heat sink with a thermal resistance of ≤0.5 K/W is recommended.
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The recommended gate resistor value is between 10 Ω and 20 Ω. A higher value may lead to slower switching times, while a lower value may cause oscillations.
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Yes, the BSM50GP60 can be used in a parallel configuration, but it's essential to ensure that the modules are matched in terms of electrical characteristics and thermal performance to avoid uneven current sharing.
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The maximum allowed dv/dt for the BSM50GP60 is 5 kV/μs. Exceeding this limit may lead to faulty operation or even damage to the module.
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BSM50GP60 Overview
Use the download button to access the BSM50GP60 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
