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BSS123_R1_00001 - PANJIT

Description: MOSFET 100V N-Channel Enhancement Mode MOSFET-ESD Protected

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PCB Footprints
BSS123_R1_00001 - PANJIT PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - sot-23
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3D Models
BSS123_R1_00001 - PANJIT  - 3D model - SOT23 (3-Pin) - sot-23
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BSS123_R1_00001 Details

  • Manufacturer Part Number:

    BSS123_R1_00001

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 3 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00.95

  • Manufacturer:

    PanJit Semiconductor

  • YTEOL:

    6.5

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    0.17 A

  • Drain-source On Resistance-Max:

    6 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    7.8 pF

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    0.5 W

  • Power Dissipation-Max (Abs):

    0.5 W

  • Reference Standard:

    IEC-61249; MIL-STD-750

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

BSS123_R1_00001 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the BSS123_R1_00001 is -40°C to 125°C, although it can withstand storage temperatures from -55°C to 150°C.
  • To ensure reliability, it's essential to follow the recommended derating guidelines for the device, especially when operating at high temperatures. Additionally, consider using thermal management techniques, such as heat sinks or thermal interfaces, to keep the device within its recommended operating temperature range.
  • The maximum allowable power dissipation for the BSS123_R1_00001 is 1.5 W, and it's essential to ensure that the device does not exceed this limit to prevent overheating and potential damage.
  • To prevent electrostatic discharge (ESD) damage, it's crucial to follow proper handling and storage procedures, such as using ESD-safe materials, grounding yourself before handling the device, and storing the device in an ESD-protected environment.
  • The recommended soldering conditions for the BSS123_R1_00001 are a peak temperature of 260°C, with a soldering time of 10 seconds or less. It's essential to follow these guidelines to prevent damage to the device during the soldering process.

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BSS123_R1_00001 Overview

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