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CM1293A-02SR - onsemi

Description: Two and four channels of ESD protection up to ±8kV contact discharge; Low loading capacitance of 2.0pF max.; Channel I/O to I/O capacitance 1.5pF typical; Zener diode protects supply rail and eliminates the need for external by-pass capacitors

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PCB Footprints
CM1293A-02SR - onsemi PCB footprint - Other - Other - SOT−143 CASE 318A−06 ISSUE U
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CM1293A-02SR - onsemi  - 3D model - Other - SOT−143 CASE 318A−06 ISSUE U
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CM1293A-02SR Details

  • Manufacturer Part Number:

    CM1293A-02SR

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-143, 4 Lead, 1.3x2.9

  • Package Description:

    SOT-143, 4 PIN

  • Pin Count:

    4

  • Manufacturer Package Code:

    318A

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Clamping Voltage-Max:

    9.9 V

  • Configuration:

    SINGLE, 2 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    0.95 V

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.225 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

CM1293A-02SR Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
  • Use X5R or X7R ceramic capacitors with a minimum capacitance of 10uF for input and output filtering. Ensure the capacitors are rated for the maximum operating voltage.
  • Use a shielded enclosure, keep the device away from antennas and high-frequency circuits, and ensure good grounding and shielding of cables and connectors.
  • Follow the JEDEC J-STD-020D.1 standard for reflow soldering, with a peak temperature of 260°C and a dwell time of 20-40 seconds.

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CM1293A-02SR Overview

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