Description:Adoption of MBIT processes; Large current capacity; Low collector-to-emitter saturation voltage; High-speed switching; Ultrasmall package facilitates miniaturization in end products (mounting height : 0.9mm); High allowable power dissipation
A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the package can help to dissipate heat efficiently. It's also recommended to use a thermal pad on the bottom of the package.
Ensure that the device is operated within the recommended temperature range (−40°C to +125°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider using a thermistor or thermocouple to monitor the temperature.
A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for the input capacitor. The capacitor should be placed as close to the VIN pin as possible to minimize noise and ensure stable operation.
Use a shielded enclosure, keep the layout compact, and minimize loop areas. Also, use a common-mode choke or ferrite bead on the input and output lines to reduce EMI. Ensure that the PCB layout follows good EMI design practices.
A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for the output capacitor. The capacitor should be placed as close to the VOUT pin as possible to minimize noise and ensure stable operation.
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CPH3116-TL-E Overview
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