Part Image

DA14531-00000FX2 - Renesas Electronics

Description: SmartBond TINY™, the world’s smallest and lowest power Bluetooth® 5.1 System-on-Chip (SoC), brings down the cost of adding Bluetooth Low Energy (LE) in any system and takes mobile connectivity to places previously out of reach, triggering a wave of a billion IoT devices, all with SmartBond TINY at the heart.The low system cost is achieved through the high level of integration in SmartBond TINY: A complete Bluetooth Low Energy system can be achieved with the addition of six tiny external passives, a crystal

Download DA14531-00000FX2 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
3D Models
DA14531-00000FX2 - Renesas Electronics  - 3D model
click to zoom
Note! To download footprints and symbols, use the build and request forms below

Build

Launch Build Wizard
Build Wizard not available for this package category!

Request (48 hours)

DA14531-00000FX2 Details

  • Manufacturer Part Number:

    DA14531-00000FX2

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    FCGQFN

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    10

  • JESD-30 Code:

    R-PQCC-N24

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCN

  • Package Equivalence Code:

    LCC24,.08X.12,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Seated Height-Max:

    0.7 mm

  • Supply Voltage-Max:

    3.3 V

  • Supply Voltage-Min:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    2.2 mm

  • uPs/uCs/Peripheral ICs Type:

    RFSoC

DA14531-00000FX2 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the DA14531-00000FX2 is -40°C to 85°C.
  • The DA14531-00000FX2 can be configured for BLE applications using the SmartBond™ software development kit (SDK) provided by Renesas Electronics Corporation. The SDK includes a range of APIs and example code to help developers get started with BLE development.
  • The maximum transmit power of the DA14531-00000FX2 is +5 dBm.
  • Yes, the DA14531-00000FX2 is compatible with Bluetooth 5.0 and supports the latest Bluetooth 5.0 features, including 2Mbps data transfer rates and long-range mode.
  • The power consumption of the DA14531-00000FX2 in sleep mode is typically around 1.5 μA.

Trust Checks

No trust score is available for this model.
Trust Score Unavailable
Sponsored

DA14531-00000FX2 Overview

Use the download button to access the DA14531-00000FX2 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like DA145, or try a keyword search, such as Other Telecom ICs

Parts related to DA14531-00000FX2

Showing 0 results

Select Package Category

Package Categories

Datasheet PDF Preview