IT ALSO HAS THRESHOLD 4, 4.2, 5.8, 6.53, 8.95, 11.05, 2, 2.8, 3, 4.6
Adjustable Threshold:
YES
Analog IC - Other Type:
INTEGRATED POWER MANAGEMENT UNIT
JESD-30 Code:
R-XBGA-B36
Length:
2.545 mm
Number of Channels:
2
Number of Functions:
1
Number of Terminals:
30
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
UNSPECIFIED
Package Code:
VFBGA
Package Equivalence Code:
BGA30,5X6,16
Package Shape:
RECTANGULAR
Package Style:
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Seated Height-Max:
0.56 mm
Supply Voltage-Max (Vsup):
10 V
Supply Voltage-Min (Vsup):
4 V
Supply Voltage-Nom (Vsup):
5 V
Surface Mount:
YES
Terminal Form:
BALL
Terminal Pitch:
0.4 mm
Terminal Position:
BOTTOM
Threshold Voltage-Nom:
+4.6
Width:
2.145 mm
DA9168-XXU72 Frequently Asked Questions (FAQs)
Renesas provides a recommended PCB layout guide in their application note (APN) document, which includes thermal design considerations, such as thermal vias, copper pours, and component placement. It's essential to follow these guidelines to ensure optimal thermal performance and prevent overheating.
Power sequencing is critical for the DA9168-XXU72. Renesas recommends a specific power-up sequence, which involves powering up the VIN pin first, followed by the VDD pin, and then the VCC pin. This sequence ensures proper device operation and prevents damage. A detailed power sequencing diagram is available in the application note.
Renesas recommends using high-quality, low-ESR decoupling capacitors with a value of 10uF to 22uF, placed as close as possible to the VIN, VDD, and VCC pins. The capacitors should be rated for the maximum operating voltage and have a low equivalent series resistance (ESR) to ensure effective noise filtering and power supply decoupling.
The DA9168-XXU72 has multiple low-power modes, including shutdown, sleep, and standby. To configure these modes, you need to use the device's control registers and follow the recommended programming sequence. Renesas provides detailed information on low-power mode configuration in their application note and programming guide.
Thermal design is critical for the DA9168-XXU72. Renesas recommends using a thermal pad on the bottom of the package, connected to a copper pour on the PCB, to dissipate heat effectively. Additionally, the device should be placed in a well-ventilated area, and thermal interfaces, such as thermal tape or thermal grease, should be used to improve heat transfer.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
DA9168-XXU72 Overview
Use the download button to access the DA9168-XXU72 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like DA916,
or try a keyword search, such as Power Management Circuits
