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DG308BDJ - Vishay

Description: Improved Quad CMOS Analog Switches

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Symbol
DG308BDJ - Vishay - PCB symbol
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PCB Footprints
DG308BDJ - Vishay PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - PDIP 16-LEAD
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3D Models
DG308BDJ - Vishay - 3D model - Dual-In-Line Packages - PDIP 16-LEAD
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DG308BDJ Details

  • Manufacturer Part Number:

    DG308BDJ

  • Part Life Cycle Code:

    Active

  • Package Description:

    DIP-16

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    4.99

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    R-PDIP-T16

  • JESD-609 Code:

    e0

  • Length:

    20.13 mm

  • Neg Supply Voltage-Max (Vsup):

    -22 V

  • Neg Supply Voltage-Min (Vsup):

    -4 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Normal Position:

    NO

  • Number of Channels:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    90 dB

  • On-state Resistance Match-Nom:

    1.7 Ω

  • On-state Resistance-Max (Ron):

    85 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.08 mm

  • Supply Voltage-Max (Vsup):

    22 V

  • Supply Voltage-Min (Vsup):

    4 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Switch-off Time-Max:

    150 ns

  • Switch-on Time-Max:

    200 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

DG308BDJ Frequently Asked Questions (FAQs)

  • A good PCB layout for the DG308BDJ should consider the following: keep the input and output traces short and separate, use a solid ground plane, and place decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable voltage source (e.g., 5V or 3.3V) and the VEE pin to a stable negative voltage source (e.g., -5V or -3.3V). The voltage difference between VCC and VEE should be within the recommended operating range (±5V to ±15V).
  • The maximum allowable power dissipation for the DG308BDJ is 500 mW. To ensure reliable operation, the device should be operated within the recommended power dissipation range, taking into account the ambient temperature and thermal resistance of the package.
  • While the DG308BDJ is a high-speed analog switch, its frequency response is limited to around 100 MHz. For high-frequency applications above 100 MHz, a more specialized device or a different architecture may be required.
  • The DG308BDJ has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.

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DG308BDJ Overview

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DG308BDJ Alternates

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Part Image DG308BDJ Vishay Siliconix

SPST, 4 Func, CMOS, PDIP16