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DN2540N5-G - Microchip

Description: Microchip DN2540N5-G N-channel MOSFET Transistor, 0.5 A, 400 V Depletion, 3-Pin TO-220

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PCB Footprints
DN2540N5-G - Microchip PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - 3-Pin TO-220 (N5)
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3D Models
DN2540N5-G - Microchip  - 3D model - Transistor Outline, Vertical - 3-Pin TO-220 (N5)
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DN2540N5-G Details

  • Manufacturer Part Number:

    DN2540N5-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    3

  • Manufacturer Package Code:

    TO-220-3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    400 V

  • Drain Current-Max (ID):

    0.5 A

  • Drain-source On Resistance-Max:

    25 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    5 pF

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    15 W

  • Pulsed Drain Current-Max (IDM):

    0.5 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    35 ns

  • Turn-on Time-Max (ton):

    25 ns

DN2540N5-G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust power-on reset circuit, ensure a stable power supply, and consider using a thermistor or thermocouple to monitor temperature. Also, follow the recommended operating conditions and derating guidelines.
  • Use a multi-layer PCB with a solid ground plane, add EMI filters or chokes on input/output lines, and consider using TVS diodes or ESD protection devices. Ensure proper grounding and shielding of cables and connectors.
  • Use the device's power-down modes, optimize the clock frequency, and minimize the number of active circuits. Consider using a low-dropout regulator (LDO) and optimizing the power supply design.
  • Implement redundant systems, use error correction mechanisms, and consider using radiation-hardened or high-reliability components. Ensure thorough testing and validation of the design.

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DN2540N5-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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