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DS2430AP+T&R - Analog Devices

Description: Maxim DS2430AP+T&R EEPROM Memory Chip, 256bit, 2.8 → 5.25 V 6-Pin TSOC

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PCB Footprints
DS2430AP+T&R - Analog Devices PCB footprint - Other - Other - D6+1
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DS2430AP+T&R - Analog Devices  - 3D model - Other - D6+1
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DS2430AP+T&R Details

  • Manufacturer Part Number:

    DS2430AP+T&R

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    6-PLCC-N/A

  • Package Description:

    SOC, SOC6,.17

  • Pin Count:

    6

  • Manufacturer Package Code:

    6-PLCC-N/A

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Date Of Intro:

    2002-02-22

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Additional Feature:

    MICROLAN COMPATIBLE

  • Clock Frequency-Max (fCLK):

    0.0163 MHz

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-C6

  • JESD-609 Code:

    e3

  • Length:

    3.94 mm

  • Memory Density:

    256 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    1

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Number of Words:

    256 words

  • Number of Words Code:

    256

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256X1

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOC

  • Package Equivalence Code:

    SOC6,.17

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Serial Bus Type:

    1-WIRE

  • Supply Voltage-Max (Vsup):

    6 V

  • Supply Voltage-Min (Vsup):

    2.8 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    MOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.76 mm

  • Write Cycle Time-Max (tWC):

    10 ms

DS2430AP+T&R Frequently Asked Questions (FAQs)

  • The recommended layout and routing for the DS2430AP+T&R involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the device and the battery. Additionally, it's recommended to use a 0.1uF decoupling capacitor between VCC and GND, and to keep the device away from high-frequency noise sources.
  • To ensure accurate temperature measurements, it's essential to follow proper thermal design practices, such as providing a thermal path between the device and the target temperature source, using a thermally conductive material, and minimizing thermal gradients. Additionally, calibrating the device and using the built-in temperature correction features can help improve accuracy.
  • The maximum number of devices that can be connected to a single 1-Wire bus is limited by the bus capacitance and the pull-up resistor value. Typically, up to 10 devices can be connected to a single bus, but this can be increased to 20 or more devices by using a stronger pull-up resistor or a bus repeater.
  • To handle errors and exceptions when communicating with the DS2430AP+T&R, it's essential to implement error detection and correction mechanisms, such as CRC checks and retries. Additionally, using a 1-Wire bus master with built-in error handling capabilities can simplify the process.
  • The recommended power-up sequence for the DS2430AP+T&R involves applying power to the VCC pin first, followed by the 1-Wire bus signal. This ensures that the device is properly initialized and ready for communication.

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DS2430AP+T&R Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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Part Image DS2430AP+T&R Maxim Integrated Products

EEPROM, 256X1, Serial, MOS, PDSO6, 3.70 X 4 MM, 1.50 MM HEIGHT, LEAD FREE, TSOC-6