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DS2715BZ+T&R - Analog Devices

Description: NiMH Battery Pack Charge Controller

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DS2715BZ+T&R - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 16 SO
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DS2715BZ+T&R - Analog Devices  - 3D model - Small Outline Packages - 16 SO
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DS2715BZ+T&R Details

  • Manufacturer Part Number:

    DS2715BZ+T&R

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-SOIC_N-150_MIL

  • Package Description:

    ROHS COMPLIANT, SOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-SOIC_N-150_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2005-05-27

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    BATTERY MONITOR

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    1.6 mA

  • Supply Voltage-Max (Vsup):

    16.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

DS2715BZ+T&R Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 4-layer PCB with a solid ground plane, and to place thermal vias under the device to dissipate heat efficiently. Additionally, keeping the PCB traces as short as possible and using a thermal pad on the bottom of the device can also help to reduce thermal resistance.
  • To ensure reliable operation in high-vibration environments, it is recommended to use a robust PCB design with a secure mounting mechanism for the device. Additionally, using a conformal coating and potting the device can help to protect it from vibration-induced stress. It is also important to follow proper soldering and assembly techniques to prevent mechanical stress on the device.
  • For optimal signal integrity, it is recommended to use a 50-ohm termination scheme for the input and output signals. This can be achieved using a series resistor and a shunt capacitor to ground. Additionally, using a differential termination scheme for the output signals can help to reduce electromagnetic interference (EMI) and improve signal quality.
  • To troubleshoot common issues such as oscillations or instability in the device, it is recommended to check the power supply voltage and ensure that it is within the specified range. Additionally, checking the input and output signal integrity, and ensuring that the device is properly terminated can help to identify the root cause of the issue. It is also important to consult the datasheet and application notes for troubleshooting guidelines and to contact Analog Devices Inc support if necessary.
  • To prevent damage to the device, it is recommended to store the devices in their original packaging or in a dry, static-free environment. Handling the devices by the body or pins can cause damage, so it is recommended to handle them by the package or use an anti-static wrist strap. Additionally, avoiding exposure to extreme temperatures, humidity, and physical stress can help to prevent damage to the device.

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DS2715BZ+T&R Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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