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DS2781E+ - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - DS2781E+ - Li-Ion, Li-Pol Battery Fuel Gauge, 2.5 V to 10 V supply, 1 Wire, Serial interface, TSSOP-8

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DS2781E+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - H8+2
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DS2781E+ - Analog Devices  - 3D model - Small Outline Packages - H8+2
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DS2781E+ Details

  • Manufacturer Part Number:

    DS2781E+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-TSSOP_4.4-4.4_MM

  • Package Description:

    LEAD FREE, TSSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-TSSOP_4.4-4.4_MM

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2006-01-09

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    BATTERY GAUGE

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -20 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.095 mA

  • Supply Voltage-Max (Vsup):

    10 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

DS2781E+ Frequently Asked Questions (FAQs)

  • The DS2781E+ requires careful layout and placement to ensure accurate measurements. It's recommended to place the device close to the battery, use a 4-layer PCB with a solid ground plane, and keep the analog and digital traces separate. Additionally, avoid placing the device near high-current or high-voltage components.
  • The DS2781E+ requires calibration for accurate measurements. Calibration involves setting the internal registers to match the specific battery chemistry and characteristics. Analog Devices provides a calibration guide and software tools to assist with the calibration process.
  • The DS2781E+ can support up to 16 batteries in series, but it's recommended to limit the number of batteries to 8 or less to ensure accurate measurements and prevent overvoltage conditions.
  • The DS2781E+ is rated for operation up to 125°C, but its accuracy and reliability may be affected at high temperatures. It's recommended to use thermal management techniques, such as heat sinks or thermal interfaces, to keep the device within its specified operating temperature range.
  • The DS2781E+ provides battery balancing and charging control through its internal registers and external pins. It can control external FETs or switches to balance the battery cells and regulate charging currents. However, the specific balancing and charging algorithms must be implemented by the system designer.

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DS2781E+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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