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DS3695AMX - Texas Instruments

Description: RS-422/RS-485 Interface IC Obsolete, LTB expires Aug-07-2018

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DS3695AMX - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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DS3695AMX - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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DS3695AMX Details

  • Manufacturer Part Number:

    DS3695AMX

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    COMMON I/O; 1 RECEIVER ACTIVE UNDER SHUTDOWN; TRISTATABLE RECEIVER

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e0

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    1.5 V

  • Output Low Current-Max:

    0.016 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    235

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    42 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    60 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Transmit Delay-Max:

    22 ns

  • Width:

    3.9 mm

DS3695AMX Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended layout and routing guide in the DS3695AMX datasheet, application notes, and evaluation module documentation. It's essential to follow these guidelines to ensure proper operation, minimize noise, and reduce electromagnetic interference (EMI).
  • To optimize the DS3695AMX for low power consumption, use the lowest possible supply voltage, reduce the clock frequency, and enable the power-down mode when not in use. Additionally, consider using a low-dropout regulator (LDO) to minimize power losses.
  • The DS3695AMX has a maximum junction temperature of 150°C. Ensure proper thermal design, including heat sinking, thermal vias, and adequate airflow to prevent overheating. Use thermal simulation tools to estimate the device's temperature and optimize the design accordingly.
  • Start by reviewing the datasheet, application notes, and evaluation module documentation. Check the power supply, clock signal, and input/output connections. Use oscilloscopes, logic analyzers, or other debugging tools to identify issues. Consult the Texas Instruments support forum or contact their technical support team for further assistance.
  • The DS3695AMX is a commercial-grade device, but it can be used in high-reliability or safety-critical applications with proper design, testing, and validation. Ensure that your design meets the required safety standards, and consider using redundant or fail-safe mechanisms to mitigate potential failures.

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DS3695AMX Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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