ROHM recommends a thermal pad size of 2.5mm x 2.5mm with a minimum of 10 thermal vias (0.3mm diameter) to achieve optimal thermal performance. Additionally, a solid copper plane on the bottom layer can help to dissipate heat efficiently.
ROHM recommends using a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 30 seconds to 60 seconds. Ensure the device is properly aligned and the solder paste is evenly distributed to prevent solder bridging or open circuits.
The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. However, for reliable operation, it's recommended to keep the input voltage within the recommended operating range of 3.3V ± 10%.
ROHM recommends using an ESD wrist strap or mat during handling and assembly to prevent electrostatic discharge. The device has built-in ESD protection, but it's still important to follow proper ESD handling procedures to prevent damage.
The recommended operating temperature range for the DTC123EU3HZGT106 is -40°C to 125°C. However, the device can operate up to 150°C for short periods of time, but this may affect its reliability and lifespan.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
DTC123EU3HZGT106 Overview
Use the download button to access the DTC123EU3HZGT106 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like DTC12,
or try a keyword search, such as Small Signal Bipolar Transistors
