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EGP20F - onsemi

Description: Low forward voltage, high current capability; Superfast recovery time for high efficiency; High surge current capability; Low leakage current; Glass passivated cavity-free junction

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EGP20F - onsemi  - 3D model
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EGP20F Details

  • Manufacturer Part Number:

    EGP20F

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    AXIAL LEAD DO 204

  • Package Description:

    GLASS PACKAGE-2

  • Manufacturer Package Code:

    017AJ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    5.95

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    300 V

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JEDEC-95 Code:

    DO-15

  • JESD-30 Code:

    O-LALF-W2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    75 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    GLASS

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Packing Method:

    TR

  • Power Dissipation-Max:

    3.13 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    300 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.05 µs

  • Reverse Test Voltage:

    300 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

EGP20F Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, using a minimum of 2oz copper thickness, and ensuring good thermal conduction to the surrounding PCB area. A thermal via array can also be used to improve heat dissipation.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including junction temperature (Tj) and storage temperature (Tstg). Additionally, consider using a heat sink, thermal interface material, and ensuring good airflow around the device.
  • When handling EGP20F devices, it's crucial to follow proper ESD protection procedures, including using an ESD wrist strap, ESD mat, and ESD-safe packaging. Avoid touching the device pins or handling the device in a way that could generate static electricity.
  • Yes, the EGP20F is suitable for high-reliability and automotive applications. However, it's essential to follow the recommended operating conditions, and consider additional testing and qualification according to the specific industry standards, such as AEC-Q101.
  • To troubleshoot issues related to the internal voltage regulator, check the input voltage, output voltage, and current consumption. Ensure that the input voltage is within the recommended range, and the output voltage is stable. Also, verify that the device is not overheating, and the current consumption is within the specified limits.

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EGP20F Overview

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Part Image EGP20F Fairchild Semiconductor Corporation

Rectifier Diode, 1 Phase, 1 Element, 2A, 300V V(RRM), Silicon, DO-15